AI startup Tenstorrent, led by chip industry veteran Jim Keller as CEO, recently announced a new generation of AI hardware featuring the Wormhole Tensix processor equipped with RISC-V...
Powertech Technology (PTI) is currently developing fan-out panel-level packaging (FOPLP) and seeking collaboration with fabless chip vendors, according to the Taiwan-based memory...
South Korea's imports of panel manufacturing equipment soared tenfold in the first half of 2024 compared to the same period in 2023, reaching approximately US$315 million. This dramatic...
Sharp has made a strategic move to enhance its mobile device wireless communication technology by acquiring communication patents from Foxconn. This acquisition aims to strengthen...
E Ink Holdings (E Ink), a leading e-paper company, is aggressively advancing its color e-paper products. In consumer applications, demand for e-readers and e-paper notebooks remains...
The shortage of talent in the semiconductor industry is no longer news. Still, the continuous growth in demand for advanced packaging has triggered a mid-to-long-term scarcity of...
Glass substrates are recognized as critical materials for next-generation advanced semiconductor packaging technologies needed to support the explosive growth of AI chips.
Glass substrates have become a critical strategic element in fan-out panel level packaging (FOPLP), a technology that TSMC and various backend houses are developing. Because of that,...
As Japan prepares to import its first-ever EUV lithography systems, ASML, the sole technology provider, plans to boost its local workforce significantly.
Despite high costs and labor shortages, TSMC has adhered to its international plans to build wafer fabrication plants in Japan, the United States, and Germany.
Although still leading in OLED panel production globally, South Korea now faces a fierce challenge from China's rapidly advancing display panel industry and this shift has sent shockwaves...
TSMC's high-performance computing (HPC) revenue share continued to rise in Q2 2024, boosting overall performance. Although Samsung Electronics aims to increase its HPC sales proportion,...
For enterprises whose operations span a diverse range of outdoor working environments, rugged IT solutions that combine purpose-built hardware with industry-specific software can...
Taiwan has established a new Defense Innovation Unit (DIU) to accelerate the integration of drones and Artificial Intelligence (AI) systems into its military strategy. This unit,...
Demands for advanced packaging services have surged as every smartphone is expected to be equipped with generative AI applications in the future. Taiwan Semiconductor Manufacturing...
