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Wednesday 8 April 2026
Apple's foldable iPhone reportedly still on track for September launch despite engineering hurdles

Apple's first foldable iPhone is reportedly facing a more complex-than-expected engineering testing phase, raising concerns about potential...

Wednesday 8 April 2026
With SpaceBridge, BWant anchors Taiwan's satellite ambitions

As global demand for satellite communications accelerates, Taiwan's role in the supply chain is beginning to shift. On April 2, BWant...

Wednesday 8 April 2026
SpaceX's Starlink Mobile faces a slow climb to scale
Space-based cellphone service has long been pitched as the next frontier in connectivity. Now, SpaceX is testing that promise with Starlink Mobile — a bet that could reshape...
Tuesday 7 April 2026
MSScorps targets CPO demand with in-house silicon photonics test platform

MSScorps has expanded its silicon photonics (SiPh) testing capabilities in recent years and will debut its in-house "MSS HG" platform...

Tuesday 7 April 2026
Tescan Showcase Integrated Failure Analysis Solutions at SEMICON China 2026

Tescan will showcase its integrated semiconductor failure analysis solutions at SEMICON China 2026, covering key stages from non-destructive testing and defect exposure...

Thursday 2 April 2026
Samsung ramps Texas fab as engineers gather for 2nm push

Samsung Electronics has reportedly moved into the equipment installation and testing phase at its foundry in Taylor, Texas, transitioning...

Thursday 2 April 2026
Mobile chip inventory correction weighs on OSAT supply chain
As the industry enters the stocking phase ahead of new smartphone launches, mobile chip customers are undergoing an inventory adjustment period. The supply chain indicates that this...
Thursday 2 April 2026
Top 10 Chart: Advanced packaging, not volume, drives OSAT shift as markets signal 2026 inflection

Taiwan's outsourced semiconductor assembly and test (OSAT) sector is entering 2026 with relatively modest revenue growth, but market behavior...

Thursday 2 April 2026
TSMC says COUPE platform set for production as Samsung outlines SiPh push

TSMC said its COUPE silicon photonics platform is set to enter volume production this year, as rising demand for high-speed interconnects...

Wednesday 1 April 2026
Northrop Grumman advances diamond chip for high-power military radar protection
Northrop Grumman's Microelectronics Center has announced a breakthrough in diamond-based receiver protection components after a device withstood more than 100 watts of power in extreme...
Tuesday 31 March 2026
MPI probe card lead times stretch to 6 months on AI chip testing surge
Taiwan-based semiconductor testing interface provider MPI Corporation has reported that strong demand from the AI chip testing market has pushed probe card lead times to as long as...
Friday 27 March 2026
Samsung and SK Hynix expand microscope procurement to boost HBM yield
As AI compute demand surges, the rising need for high-bandwidth memory (HBM) testing and failure analysis is reshaping semiconductor inspection equipment markets, affecting chipmakers,...
Wednesday 25 March 2026
Ramon.Space and Foxconn unit team to develop orbital data centers
Ramon.Space and Ingrasys announced an expanded collaboration to jointly develop a space data center platform, signaling a move to address rising energy and bandwidth pressures on terrestrial...
Monday 23 March 2026
AI chip boom drives surge in demand for testing at Chunghwa Precision Test
Chunghwa Precision Test, a supplier of semiconductor testing interfaces, is seeing a surge in demand driven by high-performance computing and mobile application processors, as orders...
Monday 23 March 2026
Tescan integrates Seoul demo lab to speed testing for AI memory and advanced packaging customers
Tescan's expansion of its Seoul site integrates a Demo Lab with office space to better serve semiconductor clients amid global AI-driven memory demand, promising faster failure analysis...