CONNECT WITH US
NEWS TAGGED TESTING
Friday 29 January 2010
Wafer testing house Ardentec to buy new plant to ramp capacity in 2010
The board of directors of wafer testing house Ardentec has decided to buy a new plant as a means to ramp up its capacity, which in turn is likely to push its capex budget for 2010...
Friday 22 January 2010
IC testing firm KYEC to see strong 1Q10
King Yuan Electronics (KYEC) is estimated to see revenues decrease by less than 5% sequentially in the first quarter of 2010, compared to drops of 10% or more usually seen in previous...
Tuesday 5 January 2010
Testing houses Ardentec, UTAC enter MediaTek supply chain
MediaTek has recently added two testing partners, Ardentec and UTAC Taiwan, and given them small-volume orders to help diversify risk, according to industry sources.
Thursday 31 December 2009
IC packaging and testing companies feeling relief after Tessera lost in lawsuit against DRAM makers
Taiwan-based IC packaging and testing companies, along with DRAM chip vendors, have felt a sense of relief after the US International Trade Commission (ITC) issued a final determination...
Wednesday 30 December 2009
PTI chairman denies merger rumors
Powertech Technology (PTI) chairman DK Tsai has denied rumors that the memory IC packaging and testing house plans to merge with Orient Semiconductor Electronics (OSE), a memory card...
Wednesday 30 December 2009
Taiwan likely to lift cross-strait ban on backend semiconductor technology soon
The Taiwan government will likely lift a ban on local firms setting up more advanced packaging and testing operations in China in early 2010, according to market sources. The government...
Tuesday 15 December 2009
TSMC to raise orders to testing partners, says paper
Taiwan Semiconductor Manufacturing Company (TSMC) plans to no longer add new capacity for wafer testing, and increase its outsourcing to backend partners Ardentec and STATS ChipPAC...
Tuesday 15 December 2009
Wafer testing house Ardentec expects growth for 4Q09
Wafer testing house Ardentec has estimated its fourth-quarter revenues will defy seasonal patterns to record a sequential growth, with order visibility already stretching to February...
Friday 11 December 2009
IC testing firm KYEC says no capex growth for 2010
IC testing company King Yuan Electronics Company (KYEC) plans to scale down its capex for 2010 to below NT$2 billion (US$61.92 billion) from the NT$2.3 billion in 2009, in a move...
Monday 7 December 2009
IC packaging and testing companies experiencing strong orders for December 09 and 1Q10
Most Taiwan-based chip packaging and testing houses have received stronger than expected orders for December 2009 as well as for the first quarter of 2010, expecting minimal seasonal...
Friday 4 December 2009
DRAM backend supplier FATC revenues down 3% in November 2009, but sees growth ahead
Formosa Advanced Technologies (FATC), a major packaging and testing service provider for DRAM makers Nanya Technology and Inotera Memories, saw November 2009 revenues drop slightly...
Thursday 26 November 2009
KYEC and Ardentec say 2010 capex to rise
Wafer testing companies King Yuan Electronics (KYEC) and Ardentec, which have raised their capex for 2009 on improved market conditions, expect their capex budgets to rise in 2010...
Friday 20 November 2009
Toshiba to form China joint venture for system LSI assembly and testing
Toshiba on November 20 announced it plans to team up with Nantong Fujitsu Microelectronics (NFME), a joint venture owned by China-based Nantong Huada Microelectronics, Fujitsu of...
Friday 20 November 2009
KYEC sees 4Q09 sales grow on quarter; aborts plans to spin off memory testing unit
King Yuan Electronics Company (KYEC) has estimated revenues to grow by up to 5% sequentially in the fourth quarter of 2009, while maintaining a 60-65% utilization rate. The IC testing...
Friday 20 November 2009
Elpida opens DRAM testing lab in Munich
Elpida Memory has held a ceremony in Munich, Germany to officially open its test laboratory for DRAM chips at its Munich Design Center, which began operations in May 2009 as a GDDR...
Next-Gen Retail Revolution: The Power of Edge AI and Cloud Surveillance
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research