Many Taiwan-based analog IC design houses expect their revenues to grow 5-15% sequentially in the third quarter of 2012 despite a conservative view held by the industry leader Texas...
At the AMD Fusion Developer Summit (AFDS), global technology leaders came together to announce the formation of the Heterogeneous System Architecture (HSA) Foundation. The HSA Foundation...
Clientron Corp., a world-leading supplier of thin client and embedded systems, in collaboration with Texas Instruments Incorporated (TI), debuts it first TI SoC (System-on-Chip) based...
Texas Instruments (TI) remained the world's No. 1 microelectromechanical systems (MEMS) manufacturer in 2011, retaining top honors after fending off runner-up Hewlett Packard (HP)...
The MEMS market reached US$10.2 billion in 2011, up 17%, according to Yole Developpement. STMicroelectronics saw its MEMS sales rise 42% to more than US$900 million on exploding demand...
Samsung Electronics' in-house development of an ARM-architecture processor, Exynos, for use in its Galaxy S III smartphone signals Samsung's stepping into development of ARM processors...
Intel will adopt the Texas Instruments-developed (TI) WL1283 Wi-Fi/Bluetooth/GPS chips for its Medfield platform to be launched in the second quarter of 2012 and Broadcom-developed...
Microsoft has recently decided the downstream partners for its development of the Windows on Arm (WOA) platform with Taiwan-based vendors only invited to play minor roles in the project,...
Taiwan-based notebook vendors are conservative about adopting Nvidia's Tegra 3 processors and may consider platforms developed by Qualcomm or Texas Instruments (TI) in 2012, according...
Numerous semiconductor suppliers headquartered around the world maintain assembly and test operations in Thailand, and many of these facilities have been affected by recent flooding...
Amazon's recently-launched Kindle Fire tablet contains a dual-core 1GHz TI OMAP 4430 processor, which reportedly is being manufactured using 45nm process technology at United Microelectronics...
Unimicron Technology will soon begin to ship its FC CSP (flip-chip chip-scale-packaging) substrates to Texas Instruments (TI) for the production of ARM-based OMAP3 CPU lineups, according...
Semiconductor Manufacturing International Corporation (SMIC) has transferred nearly its entire stake in its packaging and testing joint venture to partner United Test and Assembly...
Taipei, Taiwan, August 4, 2011 – This year, approximately 65.2 million tablets will be shipped from manufacturers to major brand vendors. While Apple is expected to continue...
Supply disruptions spurred by the Japan earthquake are continuing to cause pricing increases for general-purpose analog components that are used in most types of electronic equipment...
