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NEWS TAGGED TEXAS INSTRUMENTS
Tuesday 8 March 2011
Standalone application processors are wining in mobility markets, says Petrov Group (part 1)
Several years ago there was a widely accepted expectation that application mobile processors would be fully integrated with baseband processors on a single chip. However, today we...
Wednesday 2 March 2011
Taiwan analog IC prices affected by TI 12-inch fab going on-line
With Texas Instrument's (TI) 12-inch fab to soon commence production of analog ICs and the company lowering prices since the second half of 2010, a new analog IC price war is expected...
Tuesday 1 March 2011
Pico projectors and personal projectors show increasing popularity of DLP models, says PMA
Consumers of front projectors from the US storefronts and direct marketers (web and catalog) are increasingly choosing smaller, sub-500 lumen brightness, "New Era" projectors,...
Wednesday 23 February 2011
USB 3.0 interface to become mainstream sooner or later: Q&A with Dan Harmon, interface product marketing manager, Texas Instruments
Texas Instruments (TI) is actively venturing into the USB 3.0 interface market for notebooks, desktops and smartphones as rival Renesas Electronics is still thriving in the segment...
Thursday 27 January 2011
More handset makers to launch dual-core models
Most major handset makers all plan to launch dual-core smartphones in 2011 as Nvidia, Qualcomm, Samsung Electronics, Texas Instruments (TI) and Broadcom have come out with dual-core...
Wednesday 26 January 2011
Switch to 8-inch wafers to provide sufficient capacity and inventory flexibility for analog IC design houses
With the imminent entry of Texas Instrument's (TI) 12-inch analog IC process, Taiwan-based analog IC design houses have looked to transition to 8-inch wafers since the second half...
Friday 7 January 2011
CES 2011: RIM showcases PlayBook tablet PC
RIM is showcasing its PlayBook tablet PC at Consumer Electronics Show (CES) 2011 and the company will mainly push the device's multi-tasking capability as the main promoting point...
Thursday 6 January 2011
CES 2011: Microsoft announces support of SoC architectures for next-generation Windows
Microsoft has announced at Consumer Electronics Show (CES) 2011, that the next version of Windows will support system on a chip (SoC) architectures, including ARM-based systems from...
Thursday 6 January 2011
CES 2011: TI announces DLP Pico HD chipset
At the International Consumer Electronics Show (CES), Texas Instruments (TI) has unveiled a new era for portable high definition (HD) entertainment with the new DLP Pico HD chipset...
Thursday 6 January 2011
CES 2011: DLP Pico technology lights up new, on-the-go possibilities
Texas Instruments (TI) DLP Products has announced that more than 30 DLP Pico-enabled products, covering a wide variety of useful and unique form factors, will be on display by the...
Thursday 30 December 2010
Outsourcing of IC backend services growing
IDMs including Microchip Technology, NXP Semiconductors, STMicroelectronics and Texas Instruments (TI) have all increased outsourcing for their backend production since the fourth...
Tuesday 28 December 2010
TI capacity expansion to benefit wafer probing company Ardentec
More than 50% of Ardentec's revenues now come from IDM clients, especially from major client Texas Instruments (TI). Ardentec, a wafer probing service provider, indicated that orders...
Friday 19 November 2010
Leveraging flexible pricing: Q&A with TI Taiwan GM Robin Chen
Speculation has circulated in Taiwan that Texas Instruments' (TI) 12-inch wafer foundry plant, which is about to enter volume production for analog chips, will allow the chip vendor...
Thursday 21 October 2010
Li-Ion/Poly batteries drive high growth of battery management ICs from headsets to electric vehicles, says Petrov Group
The requirement for power-efficient and high performance solutions in Li-Ion/Poly battery-powered devices and equipment continues to open profitable growth opportunities for existing...
Friday 15 October 2010
TI announces first wafer plant in China
Texas Instruments (TI) has announced the opening of its first wafer plant in China, an 8-inch manufacturing facility located in the Chengdu High-tech Zone.