Taiwan-based Alchip Technologies, dedicated to supplying ASICs, expects the latest US restrictions on shipments of advanced chips to China to affect only 1-2% of its revenues, as...
Taiwan-based IC substrate specialists Unimicron Technology, Nan Ya PCB, and Kinsus Interconnect Technology are poised to generate sequential revenue increases in the fourth quarter...
Despite a near-term slowdown in ABF substrate demand, the demand prospects in the mid- to long-term are promising, according to TJ Tseng, chairman for Taiwan-based Unimicron Techno...
Taiwan's PCB equipment makers remain optimistic about demand prospects despite orders deferral at the request of some customers, with most of them ending the first months of the year...
Taiwan's three major IC substrate suppliers Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology have all posted record revenues for the third quarter of 2022, bolstered...
Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology all saw their August revenues increase on both sequential and on-year bases, thanks to strong ABF substrate sale...
Market observers are generally optimistic about the IC substrate and automotive PCB market prospects in the long term, with both product segments to become major growth drivers for...
PCB maker Unimicron Technology has seen demand for its HDI boards remain robust, likely to help maintain the capacity utilization for this product segment at 80-90% in the third quarter...
Robust ABF substrate demand boosted profits at Unimicron Technology and Kinsus Interconnect Technology in the second quarter of 2022, which both climbed to record highs.
Nan Ya PCB is looking to grow its automotive IC substrate sales as a proportion of company revenue to over 10% in 2022, up from 7-8% in 2021, according to company sources.
Unimicron Technology will continue ramping up its ABF substrate capacity till 2025 to cope with increasing demand from the 5G, AIoT, HPC and networking device sectors.
Taiwan-based ASE Technology and Unimicron Technology have both seized flip chip ball grid array (FC-BGA) packaging and related substrate orders for Apple's just unveiled M2 processors,...
Taiwan-based ABF substrate suppliers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology are expected to commercialize additional capacities boosting their...