COVID lockdowns in Kunshan and other Chinese cities, where high-tech manufacturing hubs are located, are impacting local businesses, including PCB makers seeing their production and...
OSAT ASE Technology with its fan-out chip on substrate (FOCoS) packaging technology is gearing up for a boom in HPC chip demand, eyeing orders from major processor vendors including...
Robust ABF substrate demand for datacenter applications will boost revenues and profits at Taiwan-based suppliers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect...
An extended COVID lockdown in Kunshan, China is not much constraining PCB and IC substrate supply from plants there operated by Taiwan-based makers Unimicron Technology and Nan Ya...
ABF substrate suppliers continue to see customers queue up for their available capacities, with the visibility of orders extended to at least 2027, according to industry sources.
Taiwan's leading PCB specialist Zhen Ding Technology is gearing up to carry out its ambitious 10-year development roadmaps for IC substrates, aiming to rank among the world's top-5...
Shipments of new Apple devices may more or less be affected by the COVID lockdowns in Shenzhen and Dongguan, where its supply chain partners including Foxconn, Unimicron Technology...
Apple has just unveiled its M1 Ultra SoC built using in-house-developed UltraFusion packaging architecture, which will be fabricated by TSMC with a 5nm process node and advanced packaging...
Apple reportedly is in talks with a Korean substrate maker for the supply of ABF-based FC-BGA substrates for processing Apple Car chip solutions, sparking concerns about which IC...
Taiwan-based optical inspection equipment (AOI) supplier Utechzone expects to post impressive revenue growth this year, driven by robust demand from chipmaking and IC substrate clients...
Unimicron Technology is already in talks with its major clients about ABF substrate orders for 2027-2030, as they seek to secure as much new capacity as possible through long-term...
Unimicron Technology has announced plans to merge with Subtron Technology, which specializes in SiP substrates, looking to integrate resources to expand product portfolios and seize...
Taiwan-based ABF substrate suppliers expect the activation of new production capacities later this year and in 2023 to boost their profits amid tight supplies, according to industry...
IC substrate supplier Unimicron Technology is showcasing its newly-developed fan-out panel-level packaging (FOPLP) substrates at the ongoing SEMICON Taiwan 2021, looking to better...
ABF substrate makers Unimicron Technology, Nan Ya PCB, and Kinsus Interconnect Technology have added capital expenditure to keep expanding production capacities, according to the...
