ASE Technology has broken ground for a new smart plant in Kaohsiung, southern Taiwan to be dedicated to advanced packaging processes, with annual production estimated at US$500 million...

MediaTek has introduced the Dimensity 800U as the latest addition in its 5G SoC lineup. The new chipset is designed for multi-core high performance and leading 5G+5G dual Sim dual...

MediaTek is expected to enter volume production of its mmWave 5G AiP (antenna in package) modules in 2021, and ASE Technology will provide backend support with its FC-AiP packaging...

A ramp-up in chip orders for IoT, 5G and automotive electronics applications will be driving 8-inch wafer fabrication demand through the first half of 2021, prompting related foundries...

Samsung Electronics has announced the immediate availability of its silicon-proven 3D IC packaging technology, eXtended-Cube (X-Cube), for today's most advanced process nodes.

Fingerprint ID chips vendor Egis Technology expects a surge in shipment pull-in from Chinese handset vendors in the third quarter of 2020, but whether this can generate a sequential...

As demand for 5G mobile phones increases, the vapor chamber (VC) is emerging to become a key component in 5G smartphone thermal management. Competition is keen among vapor chamber...

Tests of 5G smartphone downlink speed in the US and UK by Ookla show that smartphones using the 5G millimeter wave bands, on average, achieve blazingly fast downlink speeds 20 times...

Taiwan-based CIS and 3D sensor packaging specialist Xintec has kicked off volume production at its newly-installed 12-inch wafer probing lines since July, and expects the new business...

The number of 5G service subscribers in the Taiwan market is expected to total 14.3 million by 2025, representing a penetration rate of 48%, higher than a global average of nearly...

Taiwan has an opportunity to become a base for the development of mmWave technology, leveraging its established industry foundations, OEM/ODM technologies and related talent, according...

Small-to-medium-size panel shipments by Taiwan-based manufacturers soared 37.5% quarter-over-quarter and 28.9% year-over-year in second-quarter 2020.

Taiwan-based semiconductor material suppliers and distributors have enjoyed strong demand from their foundry clients for advanced-node manufacturing, and have seen clear order visibility...

HDI PCB specialist Tripod Technology expects its revenues for the third quarter of the year to grow sequentially on seasonal demand, with its capacity fully loaded thanks to increasing...

Second-quarter 2020 smartphone AP shipments to China-based vendors amounted to 169.9 million units, down 20.6% year-over-year but up 25.8% quarter-over-quarter.