Shipments of optical components by Taiwan's makers for 5G applications to China are likely to slow down in August-September as Chinese telecom operators are adjusting designs of some...

Intelligent Epitaxy Technology (IntelliEPI), which supplies compound semiconductor epitaxial wafers, will start trial production of GaN epi wafers in September, seeking to tap the...

MediaTek has announced a successful field trial that transfers data through Inmarsat's Alphasat L-band satellite in Geostationary Orbit (GEO) 35,000 kilometers above the equator....

Powerchip Semiconductor Manufacturing (PSMC), the foundry subsidiary of Powerchip Technology, has announced volume production for AI memory chips using 3D wafer-on-wafer (WoW) tech...

Taiwan's PCB industry recorded production of NT$298.1 billion (US$10.15 billion) in the first half of 2020, growing 3.4% on year despite impacts of the coronavirus pandemic and US-China...

Taiwan's PCB supply chain is trying to identify clients who may replace Huawei and HiSilicon, both of whom face tough US trade restrictions, according to industry sources.

Chunghwa Telecom (CHT), ASE Technology Holding and Qualcomm Technologies will join forces to build Taiwan's first smart factory based on 5G mmWave designated enterprise networks in...

Taiwan-based Intelligent Epitaxy Technology (IntelliEPI) has teamed up with IVWorks of South Korea to jointly develop and market GaN epi wafers based on molecular beam epitaxy (MBE)...

Huawei's chipmaking subsidiary HiSilicon has seen many of its staff in Taiwan leaving amid increasingly tough trade sanctions from the US on the Chinese tech group, according to industry...

ASE Technology has broken ground for a new smart plant in Kaohsiung, southern Taiwan to be dedicated to advanced packaging processes, with annual production estimated at US$500 million...

MediaTek has introduced the Dimensity 800U as the latest addition in its 5G SoC lineup. The new chipset is designed for multi-core high performance and leading 5G+5G dual Sim dual...

MediaTek is expected to enter volume production of its mmWave 5G AiP (antenna in package) modules in 2021, and ASE Technology will provide backend support with its FC-AiP packaging...

A ramp-up in chip orders for IoT, 5G and automotive electronics applications will be driving 8-inch wafer fabrication demand through the first half of 2021, prompting related foundries...

Samsung Electronics has announced the immediate availability of its silicon-proven 3D IC packaging technology, eXtended-Cube (X-Cube), for today's most advanced process nodes.

Fingerprint ID chips vendor Egis Technology expects a surge in shipment pull-in from Chinese handset vendors in the third quarter of 2020, but whether this can generate a sequential...