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Wednesday 9 September 2020
Suppliers gearing up for SiP demand boom
TSMC, ASE Technology, IC substrate makers including Unimicron Technology as well as international materials and equipment suppliers are all gearing up for the SiP (system-in-package)...
Wednesday 9 September 2020
HTC teams up with FET for 5G, VR developments
HTC has signed a MOU with Taiwan's Far EasTone Telecommunications (FET) to jointly develop related 5G and VR hardware devices, applications and services.
Wednesday 9 September 2020
Samsung positive about foldable smartphone sales in Taiwan
Samsung Electronics has said it will start taking pre-orders for its Galaxy Z Fold 2 5G in the Taiwan market on September 10 and delivering the devices on September 25.
Wednesday 9 September 2020
Component suppliers see growing orders from wearables and automotive electronics
Orders for components and materials from makers of consumer electronics products such as true wireless stereo (TWS) earbuds, wearables and smartwatches have begun picking up, as previously...
Tuesday 8 September 2020
FET, APT sign 5G spectrum-sharing deal
Taiwanese telecom operators Far EasTone Telecommunications (FET) and Asia Pacific Telecom (APT) have announced a collaborative deal marking the first 5G spectrum sharing project in...
Tuesday 8 September 2020
Taiwan CCL firms post mixed August results
Taiwan-based CCL makers showed mixed August results, with Elite Material (EMC) posting record-high revenues and fellow companies Iteq, Taiwan Union Technology (TUC) and Ventec Electronics...
Tuesday 8 September 2020
Open architecture 5G networks gaining momentum
The development of open architecture 5G networks has been gaining momentum recently as telecom operators worldwide are under pressure to reduce capital expenditure amid slower-than-expected...
Tuesday 8 September 2020
Chips R&D matters: Q&A with iST chairman Danny Yu
Materials analysis (MA), reliability analysis (RA) and failure analysis (FA) are increasingly needed by IC designers, wafer foundries and backend houses to support R&D projects...
Monday 7 September 2020
China gearing up development of third-generation semiconductors
China is poised to step up developing third-generation semiconductors including SiC and GaN materials for wide-ranging applications including new 5G communications, energy vehicles...
Monday 7 September 2020
Keystone, KYEC enjoy revenue growth in August
IC test interface specialist Keystone Microtech has reported consolidated revenues surged 17.6% sequentially and 61.6% on year to a record high of NT$118 million (US$4 million) in...
Monday 7 September 2020
III-V IC firms to gain from robust 5G RF, PA, ToF LiDAR demand
Taiwan's III-V semiconductor supply chain players including Win Semiconductors and Visual Photonics Expitaxy (VPEC) are poised to benefit from growing demand for RF, PA and ToF LiDAR...
Monday 7 September 2020
MediaTek-powered 5G smartphone available in the US
MediaTek has announced its new Dimensity 1000C 5G SoC, which will be powering the LG Velvet smartphone in the US on T-Mobile's nationwide 5G network.
Friday 4 September 2020
Nanya August revenue hits 6-month low
DRAM maker Nanya Technology has reported August revenue slipped 0.8% sequentially to a six-month low of NT$4.87 billion (US$166 million).
Friday 4 September 2020
CHPT, Sporton and Sigurd post double-digit revenue increases in August
Taiwan-based IC test interface solutions provide Chunghua Precision Test Tech (CHPT), mobile device certification specialist Sporton International, and testing house Sigurd Microelectronics...
Friday 4 September 2020
SiP demand to boom in 2021
System-in-package (SiP) demand will grow further on a wide range of applications enabled by the emerging 5G, AI and HPC technologies in 2021, according to industry sources.