The emerging artificial intelligence (AI) and 5G technologies are set to generate unprecedented opportunities and productivity, which will be driving the memory market growth over...
ASE Technology has already seen its chip-first FOCoS (fan-out chip-on-substrate) production yield reach 95-96%, and plans to introduce its chip-last FOCoS packaging technology with...
Asustek Computer is poised to see its smartphone business grow significantly in 2020, with overall handset ASPs trending upward and losses for its mobile device business unit further...
Far EasTone Telecommunications (FET) aims to gain an edge against its fellow telecom firms in the 5G commercial service market in Taiwan by focusing on providing vertical application...
PCB makers are cautious about their ASP growth this year due to insignificant specs upgrades in flagship smartphones rolled out by their China-based clients, according to industry...
China will be stepping up the development of its homegrown third-generation semiconductor materials and quantum computers in the next 5-10 years seeking to fully wean itself off US...
China-based flexible panel maker Royole has rolled out its second foldable smartphone, the Flex Pai 2, which is powered by a Qualcomm Snapdragon 865 CPU supporting 5G technology.
As 5G services began to roll out around the globe in 2019, 5G communication is poised to expand into commercial applications with unprecedented development potential compared to prior...
Taiwan's leading III-V semiconductor player Win Semiconductors is gearing up its foundry support for Qualcomm after having stopped shipments to Huawei/HiSilicon, as the US chipmaker...
Driven by growing demand for application processors and other device sales into 5G smartphones, the pure-play foundry market is on pace to expand by a strong 19% this year after slipping...
Taiwanese IC designers are likely to raise their quotes for power management ICs and MOSFETs for notebooks, desktop PCs and servers to reflect increased costs resulting from tight...
Economic uncertainties have increased the downward pressure on smartphone prices globally with 73% of shipments in 2020 expected to be priced below US$400, according to IDC.
Taiwan-based Unimicron, Nan Ya PCB and Kinsus Interconnect Technology have seen their ABF substrate capacities fully booked throughout the first half of 2021 thanks to strong demand...
Taiwan-based solar module maker Tainergy Tech reportedly has sent samples of its newly developed semi-insulating SiC (silicon carbide) substrates for validation by GaAs foundry specialist...
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