Samsung Electronics has said it will start taking pre-orders for its Galaxy Z Fold 2 5G in the Taiwan market on September 10 and delivering the devices on September 25.

Orders for components and materials from makers of consumer electronics products such as true wireless stereo (TWS) earbuds, wearables and smartwatches have begun picking up, as previously...

Taiwanese telecom operators Far EasTone Telecommunications (FET) and Asia Pacific Telecom (APT) have announced a collaborative deal marking the first 5G spectrum sharing project in...

Taiwan-based CCL makers showed mixed August results, with Elite Material (EMC) posting record-high revenues and fellow companies Iteq, Taiwan Union Technology (TUC) and Ventec Electronics...

The development of open architecture 5G networks has been gaining momentum recently as telecom operators worldwide are under pressure to reduce capital expenditure amid slower-than-expected...

Materials analysis (MA), reliability analysis (RA) and failure analysis (FA) are increasingly needed by IC designers, wafer foundries and backend houses to support R&D projects...

China is poised to step up developing third-generation semiconductors including SiC and GaN materials for wide-ranging applications including new 5G communications, energy vehicles...

IC test interface specialist Keystone Microtech has reported consolidated revenues surged 17.6% sequentially and 61.6% on year to a record high of NT$118 million (US$4 million) in...

Taiwan's III-V semiconductor supply chain players including Win Semiconductors and Visual Photonics Expitaxy (VPEC) are poised to benefit from growing demand for RF, PA and ToF LiDAR...

MediaTek has announced its new Dimensity 1000C 5G SoC, which will be powering the LG Velvet smartphone in the US on T-Mobile's nationwide 5G network.

DRAM maker Nanya Technology has reported August revenue slipped 0.8% sequentially to a six-month low of NT$4.87 billion (US$166 million).

Taiwan-based IC test interface solutions provide Chunghua Precision Test Tech (CHPT), mobile device certification specialist Sporton International, and testing house Sigurd Microelectronics...

System-in-package (SiP) demand will grow further on a wide range of applications enabled by the emerging 5G, AI and HPC technologies in 2021, according to industry sources.

Wireless communication modules are the important and indispensable components of Digital Economics, Internet of Things (IoT), Artificial Intelligence (AI) and Big Data Analytics....

MediaTek has announced its T750 5G chipset designed to power next-generation 5G CPE wireless products, such as fixed wireless access routers (FWA) and mobile hotspots.