Brogent Technologies has created a 5G cloud computing-based dynamic simulation VR gaming system and set up such a gaming facility at Kaohsiung Software Technology Park in southern...

IC substrate maker Kinsus Interconnect Technology will build ABF substrate production lines at a plant it recently acquired from the bankrupt Chunghwa Picture Tubes (CPT) in Yangmei,...

Demand for optical components from the datacenter and 5G sectors has been slow in third-quarter 2020, but order momentum may start picking up in the fourth quarter, according to industry...

Taiwan-based IC substrate makers Unimicron, Nan Ya PCB and Kinsus Interconnect are expected to significantly scale up their AiP (antenna-in-package) substrate shipments in 2021, driven...

PCB makers will enjoy steady seasonal demand from the handset sector through November as handset makers are expected to launch more 5G devices, according to industry sources.

The US trade restrictions on Huawei are set to affect the overall shipments of 5G mobile APs to the Chinese market in fourth-quarter 2020, and to significant change the landscape...

With the 5G era fast approaching, the market generally expects AIoT applications to rapidly become widespread across different industries mainly because large-scale connectivity is...

The Open Networking Foundation (ONF) has announced a SD-RAN (software defined radio access network) project to pursue the creation of open source software platforms and multi-vendor...

GaAs foundry Win Semiconductors has reiterated its third-quarter 2020 revenues will post a sequential growth of 4-6% with gross margin staying at over 40%, despite uncertainty in...

Taiwan's flexible PCB specialist Flexium Interconnect has seen its business operations improve significantly, reportedly as a result of entering the supply chain of flexible MPI (modified...

Government-developed Southern Taiwan Science Park (STSP) expects its revenues for 2020 to grow 15.7% on year to NT$860 billion (US$29.3 billion), mainly driven by TSMC ramping up...

SiP (system in package) combined with flexible PCB may be gaining ground in the supply chain of Apple devices, as the vendor reportedly will adopt the combination for its 5G handset...

TSMC has marked the manufacture of the one-billionth good die on the foundry's 7nm technology, which means one billion functional, defect-free 7nm chips.

Samsung is stepping up its deployments in the 3D IC packaging field, looking to compete against TSMC starting 2022 for advanced chip packaging in-house, according to industry obser...

At the inaugural Architecture Day held in late 2018, a new technical group headed by Intel senior vice president and chief architect Raja Koduri first came up with six strategic pillars...