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IN THE NEWS
Wednesday 30 January 2019
US-China tariff war casting clouds over global trade, says Taiwan trade chief
The US-China trade war has cast clouds over global trade, and Taiwan's Bureau of Foreign Trade (BOFT) will take it seriously and adopt necessary countermeasures, according to JN Yang,...
Wednesday 30 January 2019
Huawei to adopt SLP in flagship devices
Huawei reportedly will follow in the footsteps of Apple and Samsung in adopting substrate-like PCBs (SLP) in its flagship smartphone series.
Tuesday 29 January 2019
Smartphone shipments in China fall to lowest since 2013, says Canalys
Smartphone shipments in China totaled 396 million units in 2018, the lowest level since 2013, according to Canalys. Shipments for the fourth quarter of 2018 fell for the seventh consecutive...
Tuesday 29 January 2019
Holtek enters wireless headset supply chains of China handset vendors
Despite lackluster sales performance of iPhones, Apple's Airpods have ushered in a new market for wireless Bluetooth headsets, prompting China smartphone vendors such as Huawei and...
Tuesday 29 January 2019
PCB makers see little impact from Huawei 5G equipment boycott
Despite the raging US-led campaign to boycott 5G network equipment supplied by China's leading telecom equipment maker Huawei, Taiwan PCB makers are less worried about its possible...
Tuesday 29 January 2019
BOE to lead in China smartphone panel sector, says Digitimes Research
BOE Technology, which has adopted an aggressive strategy by foraying into the flexible AMOLED panel sector and stopping further investment in LTPS TFT LCD technology, is likely to...
Monday 28 January 2019
Huawei makes early preparations for 5G
As China's leading smartphone and telecom equipment maker, Huawei is moving at full throttles to strengthen its capabilities for the upcoming 5G commercialization era by placing orders...
Friday 25 January 2019
Hole-punch, foldable screens rising as new handset designs
The global smartphone market has experienced a significant boost in brand concentration rate amid lackluster sales sentiment, and brand vendors are aggressively moving to stimulate...
Thursday 24 January 2019
Intel, MediaTek, Qualcomm dominating 5G modem chips supply
While chipmakers and brand vendors of smartphones are striving to seek a preemptive presence in the segments of 5G IPs, patents and AP chips, the most critical 5G modem chip solutions...
Wednesday 23 January 2019
HiSilicon reportedly demanding 20-30% more capacity at KYEC
King Yuan Electronics (KYEC) has been requested by Huawei's semiconductor subsidiary HiSilicon to provide 20-30% more of the testing house's available production capacity in the first...
Tuesday 22 January 2019
TCA chairman warns IT players of political factors
Chairman of Pegatron and Taipei Computer Association (TCA) TH Tung, commenting on several countries considering banning the use of Huawei equipment, has said IT players worldwide...
Monday 14 January 2019
2018 review and 2019 outlook: PCB makers see new applications as growth driver
Taiwan PCB makers enjoyed strong growth in 2018 in shipments of their flexible boards, rigid-flex boards and substrate-like PCBs to new application sectors of datacenter servers and...
Friday 11 January 2019
Lackluster iPhone sales seen to affect Taiwan export, economy
In a rare move, Taiwan's top economic planner has said lackluster sales of new iPhones can be blamed partly on the devices' lack of innovations, which may directly impact revenue...
Friday 11 January 2019
Chipmakers gearing up to develop 802.11ax chip solutions
Qualcomm and MediaTek have both introduced their new 802.11ax chip solutions to support Wi-Fi 6 devices, seeking to secure a preemptive presence in both enterprise and household network...
Thursday 3 January 2019
Chipmakers keen to roll out NPU-based AI mobile SoCs
Discrete NPU (neural processing unit) is increasingly incorporated by chipmakers including Huawei HiSilicon, Qualcomm and MediaTek into their mobile chip solutions to execute AI computing...