BOE Technology, which has adopted an aggressive strategy by foraying into the flexible AMOLED panel sector and stopping further investment in LTPS TFT LCD technology, is likely to...
As China's leading smartphone and telecom equipment maker, Huawei is moving at full throttles to strengthen its capabilities for the upcoming 5G commercialization era by placing orders...
The global smartphone market has experienced a significant boost in brand concentration rate amid lackluster sales sentiment, and brand vendors are aggressively moving to stimulate...
While chipmakers and brand vendors of smartphones are striving to seek a preemptive presence in the segments of 5G IPs, patents and AP chips, the most critical 5G modem chip solutions...
King Yuan Electronics (KYEC) has been requested by Huawei's semiconductor subsidiary HiSilicon to provide 20-30% more of the testing house's available production capacity in the first...
Chairman of Pegatron and Taipei Computer Association (TCA) TH Tung, commenting on several countries considering banning the use of Huawei equipment, has said IT players worldwide...
Taiwan PCB makers enjoyed strong growth in 2018 in shipments of their flexible boards, rigid-flex boards and substrate-like PCBs to new application sectors of datacenter servers and...
In a rare move, Taiwan's top economic planner has said lackluster sales of new iPhones can be blamed partly on the devices' lack of innovations, which may directly impact revenue...
Qualcomm and MediaTek have both introduced their new 802.11ax chip solutions to support Wi-Fi 6 devices, seeking to secure a preemptive presence in both enterprise and household network...
Discrete NPU (neural processing unit) is increasingly incorporated by chipmakers including Huawei HiSilicon, Qualcomm and MediaTek into their mobile chip solutions to execute AI computing...
China's top-four leading smartphone vendors - Huawei, Xiaomi, Oppo and Vivo - are expected to be able to maintain their leaderships in their domestic market in 2019, as they will...
China-based OSAT (outsourced semiconductor assembly and test) firms are gearing up to tap into medium to high-end packaging fields, including the flip chip (FC) packaging segment...
Huawei has become the second-largest client of Taiwan Semiconductor Manufacturing Company (TSMC), and will be the first company adopting the pure-play foundry's extreme ultraviolet...
Huawei plans to launch a special edition each for its Mate 20 Pro and Nova 4 smartphones on January 1, 2019 to mark its achievement of shipping 200 million handsets in 2018.
Huawei has shipped over 200 million smartphones, including Honor-brand models, so far in 2018, surpassing a total of 153 million units shipped a year earlier, according to a company...
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