Generative AI, HPC, and large data centers are raising demand for chips with higher power efficiency, stronger thermal control, and denser packaging, making advanced packaging a more strategic part of the semiconductor supply chain. In China, panel-level packaging (PLP) is gaining traction for its larger format, higher output, and lower-cost potential.

Compal Electronics said it was scaling up its server business and expects server revenue to reach 8-10% of total sales in 2026 as AI server rack-scale systems ramp and a new Texas plant begins operations in the second half. The company reported that server sales rose to 5% of revenue in the first quarter of 2026 from less than 1% previously, driven by a shift from printed circuit board (PCB) assembly to rack-level and full-system solutions that increase revenue per project.

Quanta said demand for artificial intelligence (AI) infrastructure would be very strong in 2026 as the company pushed deeper into servers and wearable devices, and that it was expanding production in the US, Mexico, and Thailand. The remarks were made at the company's shareholders' meeting on May 29, where leadership framed AI as a major growth opportunity while reiterating a cautious approach that prioritizes profitable execution.

Foxconn has said its quantum computing work is drawing international attention, but the main challenge remains turning research into a commercial business. The company's quantum efforts could take about three years to reach an inflection point, with broader business potential expected around 2030, which may matter for industries and researchers worldwide.

Foxconn said its latest results highlight how technology manufacturing groups are reshaping supply chains for global customers. The company reported record earnings in 2025, raised dividends to a new high, and set a more ambitious profit target, signaling stronger returns for shareholders and continued investment in artificial intelligence, electric vehicles, and semiconductors worldwide.

As AI moves from cloud environments into factories and physical systems, semiconductor design is being reshaped by new demands in speed, energy efficiency, and on-site learning. At a recent system-semiconductor seminar in South Korea, Seong-jun Jang, a research center director at the Korea Electronics Technology Institute (KETI), outlined four key architectural directions for future AI chips aimed at supporting industrial "physical AI."

Delta Electronics is leaning on artificial intelligence demand to sustain growth while preparing for longer-term opportunities in micro grids and higher-end automotive systems, even as its electric-vehicle business remains under pressure.

Anthropic's post-money valuation has reached US$965 billion after its newest funding round, more than doubling its value since February 2026 and putting it past its rival ChatGPT as the two aim to reach IPO status this year.

Foxconn chairman Young Liu said the company is accelerating its move into electric vehicles, robotics, and smart cities, arguing that these businesses will drive its next phase of long-term growth.

Wiwynn Technology, a major server manufacturer for AI infrastructure, warned that shortages are emerging across a range of data-center components beyond memory, a shift that could slow global AI buildouts or push up costs over the coming years. Executives said demand for data-center hardware would remain strong for the next three to five years as large cloud and hyperscale customers continued to raise capital spending, and the company signaled the US would be a focal market for expansion.

Wistron told shareholders on May 29 that it expects artificial intelligence to be in the early stages of growth and could expand to more than 10 times its current scale, potentially accounting for over 10% of global GDP. The company disclosed at its shareholders' meeting that it had received authorization to issue up to 250 million new shares and to explore overseas depositary receipts to support anticipated increases in capital needs as revenue scales up.

Pegatron held its shareholders meeting on May 28, where market attention focused on the company's new artificial intelligence (AI) server business. The company's co-CEOs, Kuang-Chih Cheng and Kuo-Yen Teng, reiterated their earlier outlook that the business would achieve tenfold growth in 2026, adding that the group's long-term investments have gradually entered the harvest stage in recent years.

Foxconn said its AI server business is scaling rapidly as global cloud spending rises and demand for computing infrastructure spreads worldwide. Chairman Young Liu said the company is positioning for continued growth in racks, optics, and semiconductors, while also advancing work in satellites and quantum computing.

Nvidia's expanding recruitment activity in Vietnam signals a potential shift in the country's role within advanced AI infrastructure manufacturing, as Taiwanese server and EMS players continue to scale up production capacity in the region. The developments underscore Vietnam's growing importance in the global reconfiguration of AI hardware supply chains, particularly for high-end data-center systems and GPU-based servers.

Amazon Web Services (AWS) won a US$6 billion AI infrastructure agreement with Snowflake, announcing expanded deployment of its in-house Graviton CPUs and AI compute capacity as cloud providers shift focus beyond GPU-centric large language model workloads. Executives said the deal, reported by Bloomberg, The Wall Street Journal, and CNBC, reflects a broader market move toward agentic AI that places growing compute demand on CPUs for orchestration, tool calls, and continuous data movement.

Dell reported a record first quarter for fiscal 2027, with revenue rising 88% to US$43.8 billion and diluted earnings per share climbing 214% to US$4.86. The company said demand was stronger than expected across all businesses and geographies as customers moved to secure supply in a difficult environment.

Dell reported a sharp jump in first-quarter revenue and profit, saying customers moved quickly to secure supply across both traditional and AI infrastructure. The company said revenue rose 88% to US$43.8 billion and diluted earnings per share climbed 214% to US$4.86, both records for the quarter.

Cloud service providers' demand for application-specific integrated circuits, or ASICs, is increasingly locked in as advanced process nodes, advanced packaging, and component supply tighten worldwide. For readers across global tech markets, the shift means access to manufacturing capacity, not just chip design, is becoming the main determinant of who can supply the next wave of AI hardware.

MediaTek will bring a broad slate of next-generation connectivity and compute technologies to COMPUTEX 2026, highlighting Wi-Fi 8, 6G concepts, optical data-center interconnects and edge-to-cloud platforms aimed at supporting Agentic AI applications.

The Taiwanese semiconductor materials company Visual Photonics Epitaxy, a supplier of compound semiconductor wafers used in optical communications, said demand tied to artificial intelligence data centers was accelerating rapidly as the industry prepares for the transition from 800-gigabit to 1.6-terabit optical networks.

Over the past year and a half, reasoning in large language models (LLMs) has become a mainstream capability, with measurable gains across programming, mathematics, law, and healthcare. The robotics industry is now asking whether the same can be done in the physical world.

Nvidia CEO Jensen Huang gave a media interview after the "trillion-dollar dinner" in Taipei, Taiwan, on May 28, commenting on topics including competition in the artificial intelligence (AI) industry, cloud service providers (CSP) developing in-house application-specific integrated circuits (ASIC), Huawei's technological progress, Taiwan's role as a center of the AI revolution, and energy demand.

Nvidia CEO Jensen Huang hosted another "trillion-dollar dinner" at Juan Yau Restaurant in Taipei, Taiwan, on May 28, with chairmen and presidents from multiple Taiwanese artificial intelligence (AI) server and semiconductor supply chain companies attending and posing for group photos.

Copper clad laminate (CCL) maker Iteq held its 2026 annual general meeting on Thursday, with Chairman Dennis Chen saying that the continued deepening of generative AI applications, faster cloud computing and data center expansion, and steady growth in demand from new energy-related industries are boosting demand for high-end electronic materials and high-frequency, high-speed printed circuit board (PCB) markets.

Nvidia's plan to launch Rubin CPX, an inference-focused graphics processing unit for its Vera Rubin platform, has become increasingly uncertain as supply-chain activity around the product appears to have stalled, according to The Elec.