Murata Manufacturing announced plans to invest around JPY1 trillion (US$6.3 billion) in expanding multilayer ceramic capacitor (MLCC) capacity by 2030. Booming demand from data centers and AI applications has pushed up orders for MLCC makers. MLCCs are a crucial component in managing power demand.

Tong Hsing Electronic Industries (THEIL) outlined the latest developments and market trends across its four major product lines of optical communications, ceramic substrates, new semiconductor materials, and image sensors, during an earnings call on October 30.

As AI data centers expand, Taiwan is facing challenges in securing power supply, battery backup, and cooling systems, with the state-run Taiwan Power Company (Taipower) requiring about two years to build dedicated 161 kV high-voltage lines. The island's limited land and growing industrial and population demand in northern Taiwan are raising concerns over whether electricity availability will keep pace with the expansion of AI computing capacity.

South Korean energy and engineering companies are positioning themselves for the emerging small modular reactor (SMR) market, with SK Innovation (SKI) seeking to build expertise through US demonstration and early commercial projects before pursuing domestic deployment, while Samsung C&T is focusing on modular construction to shorten project timelines, reduce costs, and accelerate commercialization.

The boom in generative AI is rapidly driving demand for data center construction, making power supply, cooling, and energy management central challenges for AI infrastructure. Speaking at Hon Hai Tech Day 2026 (HHTD 26), Himanshu Prasad, Senior Vice President at Schneider Electric, projected that global data center capacity will reach 300 GW over the next four to five years, with roughly 65% of all new capacity dedicated to AI workloads.

Lite-On Technology will continue increasing capital expenditure in 2027 as cloud service providers (CSPs) pour money into the artificial intelligence (AI) infrastructure race, president Anson Chiu said. He warned that CSPs that stop investing to secure market share will pay an even higher price for falling behind in the irreversible AI era.

Dixon Technologies is pursuing separate partnerships for servers, optical communications, and advanced semiconductor packaging as it seeks a role in AI infrastructure manufacturing, although its most ambitious silicon-photonics plans remain at the evaluation stage.

Foxconn subsidiaries Foxconn Interconnect Technology (FIT) and Foxconn Industrial Internet (FII) are combining their expertise in computing, connectivity, power delivery and cooling to address increasingly complex AI infrastructure demands. Speaking at Hon Hai Tech Day, their chairmen said competition has expanded beyond individual hardware specifications to overall system performance and integration.

Lite-On Technology reported record net profit for the third quarter of 2026 as demand for AI infrastructure boosted its cloud and power businesses. The Taiwanese electronics supplier posted consolidated revenue of NT$57.4 billion (US$1.8 billion), up 9% quarter-over-quarter and 28% year-over-year, while executives said AI-related revenue had exceeded 30% of the company's year-to-date total.

Nvidia's robotics partnerships in South Korea are moving beyond initial agreements, with LG Electronics beginning partial operations at its robot-training Data Factory and LG Innotek expanding cooperation on sensing technologies. Hyundai Motor Group, another Nvidia partner, has also outlined new steps toward building AI infrastructure for robotics and autonomous driving.

Japan’s Renesas Electronics expects strong demand for AI data centers, industrial applications, and automotive semiconductors to drive 2026 revenue to JPY1.6668 trillion (US$10.55 billion), up 26.4% year-over-year, with its operating margin rising to 33.2%, according to its third-quarter 2026 earnings report.

Arm is expanding its business model from licensing Neoverse core IP and compute subsystem (CSS) technologies to selling finished server CPUs for artificial general intelligence (AGI) applications. Meta is a co-developer and primary customer, while OpenAI also plans to adopt the products. Customers can purchase processors directly, reducing the time and cost required to develop and deploy their own chips, while Arm can increase its chip sales revenue.

Realtek Semiconductor quantified its AI business for the first time at an investor conference on October 29, setting a target for high-performance computing (HPC) and edge AI revenue—including automotive and robotics applications—to exceed 30% of total revenue by 2030. These businesses currently account for a high-single-digit percentage of revenue, as AI expands into infrastructure and edge devices.

Foxconn and Nvidia took center stage at Hon Hai Tech Day 2026 (HHTD 26) on October 30, showcasing their latest collaboration in AI infrastructure, including Nvidia's newly unveiled DSX Pod Compute Container and the Spectrum-X co-packaged optics (CPO) switch manufactured by Foxconn.

Google is deepening its strategic partnership with Foxconn to accelerate AI infrastructure deployment, aiming to cut the time from chip supply to data-center deployment from the traditional 12 to 18 months to about six months, said Rehan Sheikh, vice president of global silicon chip technology and manufacturing at Google Cloud, at Hon Hai Tech Day (HHTD 26) on October 30.

Hon Hai (Foxconn) and TECO Electric & Machinery showcased a jointly developed modular data center at Hon Hai Tech Day 2026, highlighting a factory-built approach to AI infrastructure. The 40-foot container integrates computing, cooling, power, energy management, and fire protection systems, as the companies target rising global demand for AI computing capacity.

Foxconn chairman Young Liu said the company's core strengths are processing capabilities and vertical integration, as the manufacturer seeks to move beyond its long-standing image as a simple "Box Mover." At its 2026 Hon Hai Tech Day, Liu described an end-to-end model spanning design, components, assembly, software integration, and global logistics.

South Korean AI chip developers HyperAccel and Rebellions are moving beyond standalone accelerators to develop integrated data center systems, seeking to combine domestic processors, memory, and networking technologies into infrastructure capable of handling different AI workloads at lower cost.

Intel's growing server business is strengthening its operating recovery, but a factory disruption and a prolonged PC downturn threaten its ability to convert demand into near-term sales. Its third-quarter results show why the turnaround now depends as much on supplying data centers as on reviving the client business that has long anchored the company.

Oracle will offer cloud services powered by Cerebras' AI computing systems in its cloud data centers starting in 2027, giving the wafer-scale chipmaker another major cloud customer. Although the companies did not disclose Oracle's planned Cerebras hardware purchases, the deal highlights the shift toward diversified AI compute resources as inference demand accelerates.

Strong demand for AI applications and cloud services is driving investment in high-performance computing chips and AI servers, prompting Taiwan manufacturers to expand capacity and borrow from banks while retaining cash. At the same time, banks' property-related loan balances continue to decline as credit resources flow into production and the real economy.

Amazon's third quarter showed its cloud expansion translating into stronger operating profitability, while the cash demands of building AI infrastructure kept rising. The result sharpens the company's central operating challenge: sustaining rapid AWS growth while bringing new capacity into service and maintaining the economics of its much larger retail business.

Texas Instruments (TI) and NXP Semiconductors both reported 40% to 50% year-over-year growth in their industrial businesses during their latest earnings calls for the third quarter of 2026, citing AI data-center construction and robotics as key growth drivers. TI's industrial revenue reached its highest level in four years, while NXP's industrial and IoT business grew 39% year-over-year.

Qisda President Cally Ko said future infrastructure supporting autonomous physical AI would evolve beyond simply providing connectivity and power to also deliver sensing, computing, and autonomous dispatching capabilities. She also disclosed that the company's commercial drones had already secured orders and entered production, while its quadruped robots were expected to be unveiled publicly in early 2027.

Global server CPU shipments are projected to surpass the 50 million-unit milestone for the first time in 2027, reaching 52.6 million units as demand accelerates alongside the industry-wide shift from AI training to inference, according to DIGITIMES Intelligence. While Intel is expected to retain its shipment crown, rival AMD is closing in fast.