Nvidia CEO Jensen Huang's latest European trip has highlighted another strategic priority: using massive computing resources to simulate quantum systems and establish a foothold in the underlying quantum computing ecosystem.

Japan's Mitsui Kinzoku has announced its third capacity expansion plan since the start of fiscal 2026 for MicroThin, its ultrathin copper foil used in optical communications equipment. The company is accelerating production expansion to meet sustained growth in market demand.

Oracle aims to raise US$20 billion through selling stock and issuing bonds to fund its AI build-out. Its stock value dropped after the company filed the plans, a sign that investors are growing wary of hyperscalers' increasing debt before anticipated AI revenues trickle in.

Metaage, a subsidiary of Qisda, posted consolidated revenue of approximately NT$19 billion (US$583 million) for the first three quarters of 2026, up 17% from NT$16.2 billion in the same period of 2025, as enterprise IT infrastructure, software, and cloud businesses expanded. The company is targeting AI infrastructure and cloud opportunities in 2027.

Malaysia is attaching tougher conditions to its data center boom, pairing a newly approved renewable energy quota with stricter screening of power and water requests and pressure on operators to supply more of their own electricity.

Surging demand for optical communications driven by AI and data center expansion has prompted Japan's Sumitomo Electric Industries to accelerate production capacity expansion for indium phosphide (InP) substrates.

Amazon, Microsoft, Google, and Meta are expected to spend more than US$720 billion on capital expenditures in 2026 to build out AI infrastructure, nearly three times the level of two years ago. Investors are watching closely to see when the spending will begin generating returns.

The Chung-Hua Institution for Economic Research (CIER) released Taiwan's purchasing managers' index (PMI) for October 2026 on November 2, showing continued expansion, with the outlook remaining optimistic. Notably, customer inventories in the manufacturing sector have stayed excessively high for two consecutive months, while the backlog of orders index fell to its slowest pace of expansion since January 2026.

Marvell Technology's agreement to buy Lumentum Holdings would give the custom chip designer its own supply of indium phosphide (InP) lasers, one of the scarcest components in AI data center networking, and make it one of the few suppliers spanning both the electrical and optical sides of the link. The deal positions Marvell more directly against Broadcom as connections inside AI clusters move from copper toward optics packaged alongside processors and switches.

Nuvoton expects its baseboard management controller (BMC) business to grow faster in 2027 than in 2026, driven by strong AI demand, higher orders from existing customers, and new customers entering mass production. The company said new customers, including cloud service providers (CSPs) and startups, will expand its BMC shipment base.

Murata Manufacturing announced plans to invest around JPY1 trillion (US$6.3 billion) in expanding multilayer ceramic capacitor (MLCC) capacity by 2030. Booming demand from data centers and AI applications has pushed up orders for MLCC makers. MLCCs are a crucial component in managing power demand.

Tong Hsing Electronic Industries (THEIL) outlined the latest developments and market trends across its four major product lines of optical communications, ceramic substrates, new semiconductor materials, and image sensors, during an earnings call on October 30.

As AI data centers expand, Taiwan is facing challenges in securing power supply, battery backup, and cooling systems, with the state-run Taiwan Power Company (Taipower) requiring about two years to build dedicated 161 kV high-voltage lines. The island's limited land and growing industrial and population demand in northern Taiwan are raising concerns over whether electricity availability will keep pace with the expansion of AI computing capacity.

South Korean energy and engineering companies are positioning themselves for the emerging small modular reactor (SMR) market, with SK Innovation (SKI) seeking to build expertise through US demonstration and early commercial projects before pursuing domestic deployment, while Samsung C&T is focusing on modular construction to shorten project timelines, reduce costs, and accelerate commercialization.

The boom in generative AI is rapidly driving demand for data center construction, making power supply, cooling, and energy management central challenges for AI infrastructure. Speaking at Hon Hai Tech Day 2026 (HHTD 26), Himanshu Prasad, Senior Vice President at Schneider Electric, projected that global data center capacity will reach 300 GW over the next four to five years, with roughly 65% of all new capacity dedicated to AI workloads.

Lite-On Technology will continue increasing capital expenditure in 2027 as cloud service providers (CSPs) pour money into the artificial intelligence (AI) infrastructure race, president Anson Chiu said. He warned that CSPs that stop investing to secure market share will pay an even higher price for falling behind in the irreversible AI era.

Dixon Technologies is pursuing separate partnerships for servers, optical communications, and advanced semiconductor packaging as it seeks a role in AI infrastructure manufacturing, although its most ambitious silicon-photonics plans remain at the evaluation stage.

Foxconn subsidiaries Foxconn Interconnect Technology (FIT) and Foxconn Industrial Internet (FII) are combining their expertise in computing, connectivity, power delivery and cooling to address increasingly complex AI infrastructure demands. Speaking at Hon Hai Tech Day, their chairmen said competition has expanded beyond individual hardware specifications to overall system performance and integration.

Lite-On Technology reported record net profit for the third quarter of 2026 as demand for AI infrastructure boosted its cloud and power businesses. The Taiwanese electronics supplier posted consolidated revenue of NT$57.4 billion (US$1.8 billion), up 9% quarter-over-quarter and 28% year-over-year, while executives said AI-related revenue had exceeded 30% of the company's year-to-date total.

Nvidia's robotics partnerships in South Korea are moving beyond initial agreements, with LG Electronics beginning partial operations at its robot-training Data Factory and LG Innotek expanding cooperation on sensing technologies. Hyundai Motor Group, another Nvidia partner, has also outlined new steps toward building AI infrastructure for robotics and autonomous driving.

Japan’s Renesas Electronics expects strong demand for AI data centers, industrial applications, and automotive semiconductors to drive 2026 revenue to JPY1.6668 trillion (US$10.55 billion), up 26.4% year-over-year, with its operating margin rising to 33.2%, according to its third-quarter 2026 earnings report.

Arm is expanding its business model from licensing Neoverse core IP and compute subsystem (CSS) technologies to selling finished server CPUs for artificial general intelligence (AGI) applications. Meta is a co-developer and primary customer, while OpenAI also plans to adopt the products. Customers can purchase processors directly, reducing the time and cost required to develop and deploy their own chips, while Arm can increase its chip sales revenue.

Realtek Semiconductor quantified its AI business for the first time at an investor conference on October 29, setting a target for high-performance computing (HPC) and edge AI revenue—including automotive and robotics applications—to exceed 30% of total revenue by 2030. These businesses currently account for a high-single-digit percentage of revenue, as AI expands into infrastructure and edge devices.

Foxconn and Nvidia took center stage at Hon Hai Tech Day 2026 (HHTD 26) on October 30, showcasing their latest collaboration in AI infrastructure, including Nvidia's newly unveiled DSX Pod Compute Container and the Spectrum-X co-packaged optics (CPO) switch manufactured by Foxconn.

Google is deepening its strategic partnership with Foxconn to accelerate AI infrastructure deployment, aiming to cut the time from chip supply to data-center deployment from the traditional 12 to 18 months to about six months, said Rehan Sheikh, vice president of global silicon chip technology and manufacturing at Google Cloud, at Hon Hai Tech Day (HHTD 26) on October 30.