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Monday 11 May 2026
From Quantum Origins to Analog AI: How Irreversible is Redefining Edge Computing
As the global technology industry descends on Taipei for COMPUTEX 2026 this June, a Canadian startup is preparing to challenge the fundamental architecture of modern processing. Irreversible, a Montreal-based firm with deep roots in quantum computing, is unveiling a "physics-first" analog in-memory computing architecture that promises a staggering 1,000x reduction in power consumption compared to conventional digital processors.Unlike many silicon startups that originate in traditional chip design, Irreversible’s journey began in the highly constrained world of quantum physics. The core team originally specialized in quantum computing, where they were forced to solve computing problems within the extreme limitations of a dilution refrigerator - an environment where even the slightest heat or noise can destroy a fragile quantum state. Co-Founder Dominic Marchand explains that this background led them to become a "computing company that found its way to designing chips," rather than the reverse. This unique DNA pushed the team to strip away decades of architectural abstractions and return to the most basic laws of physics to find the most energy-efficient ways to process information.The current industry obsession with massive Large Language Models (LLMs) has created a significant energy crisis, particularly at the "extreme edge" where devices must operate on microwatt-class power. Irreversible addresses this by sidestepping the Von Neumann bottleneck, the energy-intensive movement of data back and forth between memory and the processor. By performing calculations directly in memory and maintaining a fully analog signal path, Irreversible also eliminates the power-hungry digital-to-analog conversions that often limit hybrid AI chips. This approach recognizes that while digital logic offers noise protection, the energy required to strictly maintain ones and zeros is a luxury that edge sensors can no longer afford.A critical point of differentiation is how Irreversible compares to other innovators in this space. Marchand notes that while he is proud of the Canadian leadership in analog in-memory compute, Irreversible maintains several distinct advantages. First, the company is memory-agnostic, meaning they are not tied to a single proprietary memory technology and can instead utilize various non-volatile memories and emerging RRAM roadmaps. Second, the company places extraordinary emphasis on its software and simulation tools, which allow their hardware and software teams to work in lockstep. Their proprietary hardware-aware training ensures that neural networks remain accurate by accounting for the inherent variability of analog circuits during the initial training phase.For their up-coming visit to Taipei, Irreversible has set clear strategic objectives to integrate with the world's leading semiconductor ecosystem. A primary goal is establishing high-level connections with semiconductor foundries to gain privileged access to specific memory cells, which are essential for their "physics-first" custom designs. Additionally, the company is actively seeking partnerships with OEMs and solution integrators. By bringing intelligence directly to the sensor site, Irreversible aims to enable "previously impossible" use cases, such as deploying sophisticated AI on small drones or always-on wearable devices that cannot support a traditional GPU. Ultimately, Irreversible arrives in Taipei not just to showcase a chip, but to advocate for a shift in how the world thinks about intelligence. By trading the rigid certainty of digital bits for the natural efficiency of physics, they are proving that the future of AI isn't just about more power - it's about more efficient computing.
Monday 11 May 2026
Mecademic: Redefining Precision with Micro-Automation
Mecademic Industrial Robotics, a Montreal-based robot manufacturer in Canada, is redefining the landscape of precision manufacturing through its pioneering work in micro-automation. At the heart of their innovation is the Meca500, a six-axis industrial robot designed with a footprint so compact that it matches the size of a standard sheet of letter paper when in its shipping pose. "Everything that has gone into this design has been aimed at achieving the highest possible precision," said Naveen Krishnan, Director of Application Engineering at Mecademic. "For us, five microns is the ultimate goal." While traditional industrial robots often rely on bulky external cabinets, Mecademic's architectural simplicity integrates the controller directly into the robot's base. This plug-and-work system eliminates the need for large external hardware, saving critical floor space in capital-intensive environments like clean rooms.Unmatched PrecisionMecademic specializes in micro-automation, addressing a market segment that requires extreme precision in a small footprint. Their flagship Meca500 achieves a repeatability of five microns - thinner than a red blood cell. According to Naveen Krishnan, this level of precision is the result of a "ground-up" design philosophy. Unlike systems built from commercially available off-the-shelf (COTS) components, Mecademic vertically integrates its mechanical, electrical, and software designs, using specialized harmonic drives and high-precision encoder systems to ensure reliability and performance.An Open and Accessible ArchitectureAs noted above, one of the company's most significant innovations is the integration of  the controller directly into the robot's base, eliminating the need for bulky external cabinets. This "plug-and-work" architecture allows system integrators to replace complex, fixed Cartesian systems with a  single, more flexible manipulator.Furthermore, Mecademic has adopted an open, language-agnostic approach to programming. Instead of forcing users to learn proprietary languages, the robot can be operated via a TCP/IP interface using modern languages like Python or C#. This lowers the barrier to entry for New Product Introduction (NPI) teams and process engineers who may not be traditional automation experts. For industrial users with a requirement for industrial real-time fieldbus protocols, there is native support for Ethernet/IP, EtherCAT, and Profinet built into the standard system.Targeted Applications and Market StrategyMecademic targets high-tech verticals where miniaturization is the dominant trend, specifically within the semiconductor, medical device, and optics sectors. The Meca500 is particularly effective for tasks that involve handling very small parts typically managed by human operators using tweezers under a microscope, such as assembling medical implants or characterizing sensors. To further address niche demands, the company introduced the Meca500-OB, which uses specialized finishes and light-absorbing materials to reduce reflectivity during sensitive measurement tasks involving lasers and interferometers.Key industries include: 1. Electronics & Semiconductors: Handling small parts for testing, assembly, characterization, and sensor validation. 2. Life Sciences & MedTech: Lab automation, sample handling (microplates/vials), and medical device assembly. 3. Optics & Photonics: Sensitive measurement tasks using the Meca500-OBto prevent reflectivity during laser interferometry.Looking Toward COMPUTEX 2026As Mecademic prepares for the InnoVEX, the company aims to educate the market on how micro-automation can bridge the gap between manual labor and full-scale industrial robotics. Philippe Beaulieu, CEO, and Ammon Liu, Sales Director ASEAN, are expected to represent the firm in Taipei.By replacing capital-intensive manual processes with repeatable, high-throughput robotic solutions, Mecademic provides the essential hardware platform necessary for the next generation of AI-driven, high-precision manufacturing.
Wednesday 6 May 2026
New Wafer Inspection and Metrology Platform
Test Research, Inc. (TRI), the leading provider of Test and Inspection solutions for the electronics manufacturing industry, is proud to announce the launch of the TR7950Q SII Series. This highly modular platform is a dedicated solution for Back End Process and Advanced Packaging Inspection, ranging from patterning to wafer saw, and is engineered to set new benchmarks in wafer inspection and micro-measurement metrology.The AI-powered Wafer Metrology and Inspection Platform, TR7950Q SII, is built on a high-stability granite platform and the system supports 6" to 12" wafers. The platform features robust Automated Visual Inspection (AVI) for high-speed detection of surface defects, including particles, scratches, chipping, contamination, and foreign materials.The optional Short-Wave Infrared (SWIR) module allows the system to penetrate silicon to detect hidden inner cracks and subsurface defects invisible to standard sensors. For high-detail requirements, the platform offers 0.5 µm or 1 µm high-resolution imaging via the 3D DFF (Depth from Focus) module.The TR7950Q SII provides high-precision metrology for wafer thickness, top-side warpage, and complex surface topography, alongside high-speed sensing for Through-Silicon Via (TSV) depth, trench dimensions, thin film, and Chiplet metrology. Please visit the link to learn more about the TR7950Q SII.Credit: TRI
Monday 4 May 2026
GUC and Wiwynn partner for next-generation AI system infrastructure
Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced a strategic technical collaboration with Wiwynn, an innovative cloud IT infrastructure provider for data centers. This collaboration integrates GUC's flagship SoC design and 2.5D/3D advanced packaging with Wiwynn's expertise in rack-scale system integration, liquid cooling and optical interconnect. Together, the collaboration enables hyperscale customers to transition more efficiently from silicon definition to deployment-ready AI infrastructure.AI clusters continue to scale in performance, bandwidth and power density, hyperscalers must increasingly evaluate silicon, packaging, interconnect, thermal and rack-level design choices much earlier in the development cycle. Through this collaboration, GUC and Wiwynn are aligning key technology pillars, including leading-edge ASIC implementation, 2.5D/3D advanced packaging, optical I/O, power delivery, thermal architecture, manufacturability, serviceability and rack-scale integration. By addressing these factors holistically at the outset, the collaboration partners aim to reduce integration complexity, improve development efficiency and accelerate the transition from silicon-ready innovation to system-ready AI infrastructure."As AI infrastructure evolves beyond chip-level optimization and scale-up networks push the limits of conventional electrical interconnects, close alignment across silicon to system architecture become critical," said Aditya Raina, Chief of Marketing of GUC. "By collaborating with Wiwynn, we are helping hyperscale customers evaluate critical system-level tradeoffs earlier, integrating optical I/O to deliver the bandwidth and power efficiency required for next generation AI systems. This partnership establishes a more practical, holistic path from flagship ASIC development to deployable, rack-scale AI infrastructure."With deep expertise across board-level innovation, rack-scale integration, and manufacturing, Wiwynn effectively bridges semiconductor innovation with data center deployment," said Tony Wen, Vice President at Wiwynn. "Together with GUC, we are enabling a comprehensive silicon-tosystem approach that delivers scalable, efficient and serviceable AI infrastructure tailored for nextgeneration hyperscale environments."For more information, please visit.
Monday 4 May 2026
Cincoze Launches New Slim Industrial Display Solutions
Cincoze has unveiled its all-new CV-200 Series slim-bezel industrial displays. The CV-200 Series features a minimalist profile, a narrow bezel, and industrial-grade reliability for industrial panel PCs and industrial touch monitors. Specifically engineered for modern factory HMI and process visualization, they carefully balance the durability required for harsh environments with seamless equipment integration and intuitive operation. The modular design of the CV-200 Series offers screen sizes from 10 to 21.5 inches for over 40 possible configurations. The first release is the 21.5" Full HD models with almost ten configuration options for various application needs.Ultra-Slim Bezel, High Visibility, and an Intuitive User ExperienceThe CV-200 Series offers clear visuals and smooth operation, and integrates easily into production line equipment. Its slim, die-cast aluminum alloy frame has a bezel less than 3mm wide, increasing the display area without changing existing equipment setup. The Full HD screen and 178° wide viewing angle ensure clear and crisp readability from any position. Every model features a projective capacitive (P-Cap) touchscreen with an anti-glare (AG) coating for the clearest images, even in high-brightness indoor lighting conditions. Touch response is fast and precise, making daily HMI operation smoother and more natural.Rugged and Durable for Industrial and Humid EnvironmentsThe CV-200 Series is built to handle harsh, humid industrial environments. It has an IP66-rated front panel and Wet Tracking technology, so the touchscreen works reliably even with wet fingers or splashes of water. The backlight lasts up to 50,000 hours, and a 7H hardness Glass-Glass (GG) panel adds durability. The CV-200 Series meets the IEC 61000-6-4 industrial EMC standard, ensuring stable, long-term operation and giving operators total peace of mind.Flexible Modular DesignCincoze's exclusive Convertible Display System (CDS) technology lets you pair the CV-200 Series with embedded computer modules (P2000/P1000 Series) or monitor modules (M1000 Series). Customers can configure the system as either an industrial panel PC or an industrial touch monitor, depending on display size, computing performance, and functional requirements. This plug-and-play design simplifies deployment and maintenance. If repairs are needed, only a single module needs to be replaced, cutting downtime, lowering maintenance costs, and streamlining future upgrades.
Wednesday 29 April 2026
Chroma Paper Award: Boosting AI Innovation and Industry-Academia Ties
Chroma ATE Inc. successfully concluded the 3rd Chroma Paper Award on March 19, marking another milestone in the company's ongoing commitment to industry-academia collaboration. Organized in partnership with National Taiwan University of Science and Technology (Taiwan Tech), the Chroma Paper Award provides an exchange platform that accelerates the translation of research into real-world applications, fostering innovation and the cultivation of key talent.As high-performance computing (HPC) and AI applications continue to advance rapidly, demand for test and measurement technologies is rising across AI chips, HPC, and data centers. In this era of lightning-fast iteration, testing and validation have become critical enablers of system performance and reliability. With long-standing expertise in this field, Chroma has built comprehensive AI-related testing capabilities spanning the four core pillars of AI infrastructure: compute and data processing, cooling and thermal management, high-speed communications and data transmission, and power and energy management. Through its test and validation solutions, Chroma helps ensure the performance, stability, and reliability of AI systems, playing a vital enabling role across the AI value chain.Aligned with Chroma's core technology development priorities, this year's competition featured two main categories: Power Electronics-Related Technologies and Semiconductor Testing-Related Technologies. Each category included a Top Prize (NT$200,000), Excellence Prize (NT$100,000), and Merit Prize (NT$20,000), with total prize funding reaching nearly NT$1.5 million. A total of 101 papers were submitted. Following a multi-stage evaluation process comprising preliminary, secondary, and final reviews, the judging committee selected outstanding research projects distinguished by both technical innovation and strong potential for industrial application.In the Power Electronics-Related Technologies category, the Top Prize was awarded to a team from Taiwan Tech for the project "Development of a High Power Density Power Module for AI Server Applications." Supervised by Associate Professor Yu-Chen Liu and completed by student Yu-Jun Li, the project directly addresses the growing need for high-efficiency, high-power-density power systems in AI data centers.In the Semiconductor Testing-Related Technologies category, the Top Prize went to a team from National Taiwan University for the project "A Novel Full-Chip Afterpulsing Evaluation Technique for 116 x 160 Ge-on-Si SPAD Array." Supervised by Professor Chao-Hsin Wu and jointly completed by students Jia-Zhen Cai, Ren-Hong Zhang, and Qi'en Chen, the research presents innovative achievements in advanced sensing and semiconductor testing technologies.Following the award ceremony, Chroma invited finalist teams into its R&D labs and testing facilities to see firsthand how research outcomes are transformed into real systems and industrial applications. The visit further strengthened ties between academia and industry.As the AI era continues to evolve at speed, test and measurement serves not only as a gatekeeper of quality but also as a key engine of innovation. Looking ahead, Chroma will continue to deepen its engagement with the global academic community through the Chroma Paper Award and a range of industry-academia collaboration initiatives, building an open and impactful platform that advances key technologies and sustains innovation momentum across the industry.For the full list of award winners, please visit the official Chroma Paper Award website.President Jia-Yush Yen of National Taiwan University of Science and Technology delivers remarks. Credit: ChromaCredit: ChromaFinalist students pose for a group photo with Chroma Foundation Chairman Paul Ying. Credit: ChromaChroma ATE Chairman Leo Huang (left) poses with the Top Prize-winning student Yu-Jun Li. Credit: ChromaChroma ATE Chairman Leo Huang (left) poses with the Top Prize-winning student Jia-Zhen Cai. Credit: ChromaFinalist teams visit Chroma headquarters. Credit: ChromaGroup photo at the 3rd Chroma Paper Award ceremony and banquet. Credit: ChromaChroma ATE Chairman Leo Huang delivers remarks. Credit: ChromaChroma Foundation Chairman Paul Ying delivers remarks. Credit: Chroma
Tuesday 28 April 2026
AI anti-fraud solution wins virtual asset security hackathon
The rapid advancement of generative artificial intelligence (GenAI) has significantly enhanced the efficiency of content creation and dissemination. At the same time, it has accelerated the proliferation of misinformation, manipulated content, and digital fraud, posing increasing challenges to democratic governance, social stability, and the integrity of digital trust and information ecosystems. In this context, achieving a balance between technological innovation and risk governance, while strengthening a trusted information environment, has become a key priority for both government and industry in Taiwan.Concurrently, the global expansion of virtual asset investment has prompted jurisdictions worldwide to strengthen regulatory frameworks governing digital asset transactions. Despite these efforts, fraudulent activities involving virtual assets continue to evolve in both scale and complexity. Malicious actors frequently exploit nominee accounts to conduct layered money laundering schemes, resulting in delayed fraud detection and challenges in asset recovery. Conventional approaches -including static blacklists and rule-based controls-are increasingly insufficient to address these evolving threats. As a result, the development of highly interpretable, AI-enabled early warning mechanisms to support timely risk identification and mitigation has emerged as a critical focus for both policymakers and industry.Against this backdrop, Team Bibi Lab, comprising students from National Tsing Hua University (NTHU), was awarded top honors in the "Virtual Asset Transaction Security" category-sponsored by BitoPro, a cryptocurrency exchange under BitoGroup-at the "Agent for Truth: Disinformation Defense Hackathon." Their project, "AI Anti-Fraud Guardian for Virtual Currency Transactions," demonstrated a high degree of technical innovation and real-world applicability, earning strong recognition from the judging panel.Team Bibi Lab extracted 140 features across 18 categories from KYC, fiat currency, and cryptocurrency transaction data provided by BitoPro. At the core of their approach is an innovative "three-layer risk tracking mechanism," which analyzes shared wallets, shared IP addresses, and indirectly connected users to trace how risk propagates through the transaction network-forming one of the system's most critical signal sources.To ensure high interpretability and support compliance requirements, the team deliberately avoided complex ensemble models that could obscure decision logic. Instead, they adopted LightGBM combined with Focal Loss, enabling the model to focus on hard-to-detect minority cases and effectively address severe data imbalance.In addition, the team constructed a network graph of internal transfers, shared wallets, and common IP addresses using NetworkX. By applying algorithms such as PageRank and community detection, they identified critical relay nodes within fund flows, further strengthening the system's ability to uncover hidden fraud patterns.The competition was powered by Amazon Web Services (AWS), whose cloud infrastructure enabled Team Bibi Lab to build a comprehensive AI-driven anti-fraud system. Their solution features a four-layer interpretability architecture: "Continuous Risk Scoring and Tiering," which classifies users into four risk levels from low to extremely high; "Feature Deviation Analysis," which visualizes how user behavior diverges from baseline norms; "Rule-Based Interpretation," which generates automated textual explanations; and an "AI Risk Diagnosis Report," which leverages the Claude 3.5 Haiku on Amazon Bedrock to generate professional compliance analysis reports.The system is built on a robust AWS cloud stack. The solution is deployed on Amazon Elastic Compute Cloud (Amazon EC2), with raw data and feature matrices stored in Amazon Simple Storage Service (Amazon S3), and AWS Glue handling ETL and feature engineering. AWS Lambda supports batch risk scoring, while AWS Step Functions orchestrates the end-to-end workflow. For high-risk cases, Amazon Simple Notification Service (Amazon SNS) sends real-time alerts to compliance teams, and Amazon CloudWatch ensures system monitoring and alerting-demonstrating the breadth and scalability of AWS cloud services in supporting advanced AI application development.Team Bibi Lab noted that, despite their background in AI development, they had no prior experience with AWS cloud services. Prior to the competition, AWS organized a series of technical workshops-covering AI applications and enterprise data-enabling the team to quickly build proficiency with relevant tools and services.With guidance from BitoPro mentors and industry experts, the team deepened its understanding of cryptocurrency operations. They also incorporated key design principles-including "auditability for compliance personnel" and "automated risk alerting" -into their solution, ultimately delivering a practical, deployable anti-fraud system that contributes to a more resilient and trustworthy digital financial ecosystem.
Monday 27 April 2026
Anti-fraud hackathon winner showcases multi-dimensional tech-nology framework
In Taiwan, scams have evolved from isolated tactics into cross-channel, multi-step attack schemes. Most victims are aware of fraud; rather, they are often driven to make poor decisions under conditions of high pressure, limited information, and tight time constraints. Enabling individuals to access reliable risk assessments and timely guidance before taking critical actions has therefore become an urgent priority.At the same time, rapid advances in generative AI have accelerated the proliferation of sophisticated misinformation, deepfakes, and fraud schemes, posing growing threats to social trust and public safety. Strengthening information verification and risk mitigation through AI has thus emerged as a pressing global challenge.In the "Agent for Truth: Disinformation Defense Hackathon," Team (1), formed by members from the Department of Electrical Engineering at National Taiwan University, was awarded the "Excellent Award" in the "Fraud Identification and Prevention" category, sponsored by Gogolook, for its solution "FakeOff."Fraud tactics continue to evolve rapidly, often leveraging current events to lower public vigilance. For instance, during the tax filing season, deceptive SMS messages tend to surge. Traditional anti-fraud models, which rely heavily on historical datasets, often lack the ability to proactively detect newly emerging fraud patterns.Team (1) explained that "FakeOff" addresses this limitation through a continuous learning and data alignment mechanism. By leveraging web scraping technologies to monitor major news platforms, the system captures real-time events and applies AI to identify content that could potentially be exploited by malicious actors. This approach enables model training and deployment prior to the large-scale spread of fraudulent messages, thereby strengthening early-stage fraud prevention.The competition was powered by Amazon Web Services (AWS), providing cloud infrastructure that enabled teams to build and deploy advanced AI solutions at scale. Team (1) utilized AWS infrastructure to build a comprehensive AI-driven anti-fraud system. The solution was deployed on Amazon Elastic Compute Cloud (Amazon EC2), with large-scale fraud datasets and training data stored in Amazon Simple Storage Service (Amazon S3). It also leveraged Amazon Titan Text Embeddings V2 on Amazon Bedrock for efficient text vectorization, highlighting the breadth and scalability of AWS cloud services in supporting advanced AI application development.From a technical architecture perspective, "FakeOff" integrates the visual language model Claude Sonnet 4.6 to analyze screenshots and textual content. The system adopts a multi-agent collaborative framework built on Claude Haiku 4.5, in which a Function Calling Agent dynamically invokes fraud detection tools, blacklists, and number lookup APIs based on visual cues. A Conclusion Agent then consolidates these outputs to generate interpretable assessment reports and actionable prevention recommendations.To address the core challenge of fraudulent message detection, "FakeOff" incorporates a cross-model alignment and voting mechanism. By integrating leading large language models-including GPT-4o, Claude Sonnet 4.5, Llama 3 70B, Mistral, and Qwen3-30B-the system performs cross-validation to identify models that best capture the nuances of the Chinese language. It further enhances performance by localizing and training on global datasets, effectively addressing the limited availability of fraud-related data in Taiwan.The solution also adopts a continuous learning architecture, combining Amazon Titan Text Embeddings V2 for text vectorization with a neural network classifier. This design enables ongoing model refinement through real-world data and human feedback, ensuring sustained accuracy and adaptability in an evolving fraud landscape.To counter emerging fraud tactics, "FakeOff" autonomously scans recent news across multiple platforms to extract high-risk keywords, enabling early detection of new scam patterns without requiring full model retraining. This forward-looking technical approach was a key factor in earning strong recognition from the judging panel.Team (1) noted that, with on-site support from AWS Solution Architects and mentorship from Gogolook, the competition enabled the team to expand its perspective beyond purely technical development to encompass real-world application scenarios. The team also expressed its aspiration to contribute to fraud prevention and strengthen information security.
Monday 27 April 2026
SK hynix receives 2026 IEEE Corporate Innovation Award
SK hynix Inc. (or "the company", www.skhynix.com) announced today that it received the Corporate Innovation Award at the '2026 IEEE1 Honors Ceremony' held in New York on the 24th (local time).IEEE is the world's largest technical professional organization dedicated to advancing technology for the benefit of humanity. Established more than a century ago, the IEEE Awards Program recognizes individuals and teams whose innovations have advanced technology and improved the human condition.The IEEE Corporation Innovation Award, part of the Recognitions category, has been presented since 1986 to companies that have significantly contributed to the advancement of industry and society through innovative technology. This marks the first time SK hynix has received this honor.SK hynix attributed the honor to its contribution to the global AI computing ecosystem by ensuring the stable mass production of all High Bandwidth Memory (HBM) generations. Looking ahead, the company aims to solidify its position as a trusted partner in the global AI market by providing memory solutions that are critical to overcoming the performance limitations of AI platforms.The recognition highlights SK hynix's achievements in driving the expansion of AI computing through HBM innovation and application. Central to this success was the company's ability to preemptively offer innovative HBM solutions and respond timely to customer demands in the global AI market.Industry observers also credit this achievement to the strategic direction of SK Group Chairman Chey Tae-won, who has long emphasized securing long-term technological competitiveness. Under his leadership, the company has consistently expanded its AI infrastructure partnerships with global Big Tech firms in the United States.Ahn Hyun, President and Chief Development Officer (CDO), attended the ceremony as the company representative to accept the award."It is an honor to receive this award on behalf of our employees, who have tirelessly challenged the limits of technology," said Ahn. "By collaborating closely with our global customers and partners, we will stay ahead in creating the value the market demands and continue to be a premier company leading AI innovation."
Friday 24 April 2026
NewPower Named HPE 2026 Partner of the Year
NewPower Worldwide today announced it was recognized by Hewlett Packard Enterprise (HPE) at the HPE Operations Partner Summit 2026, receiving the Spares Supply Chain Partner of the Year Award for outstanding performance as a global supply chain partner.The award recognizes partners who deliver exceptional operational execution, responsiveness, and reliability in support of HPE's global supply chain customer base. NewPower Worldwide was selected for its ability to secure critical components, perform under pressure, and meet rigorous sourcing and fulfillment requirements in a rapidly changing market."We are honored to receive this prestigious award, which reflects our strong partnership with HPE and validates that our systems and processes are built to scale and adapt in the fast-paced market we serve together," said Carleton Dufoe, CEO of NewPower Worldwide.NewPower Worldwide supports complex global supply chains across OEMs, ODMs, and EMS providers through advanced component sourcing, inventory strategy, and risk?managed fulfillment. The company is known for executing under constraint, enabling continuity when availability is tight and conditions shift quickly. Its global operating model allows partners to respond faster, reduce exposure, and maintain performance across regions.The recognition was presented during the HPE Partner Summit 2026, which brings together top performing partners to recognize excellence in operational performance, collaboration, and customer impact.