At SEMICON Taiwan 2026 Booth T9116, SiliconAuto will showcase automotive-grade silicon solutions for Physical AI, developed through collaboration across Taiwan's world-leading semiconductor ecosystem. Visitors can experience live demonstrations of technologies designed to power future robotics and autonomous driving applications...
Tescan will participate in SEMICON Taiwan 2026 from September 2 to 4 at Booth R8201, 4F, Taipei Nangang Exhibition Center Hall 2 (TaiNEX 2). Under the theme "Streamlined Failure Analysis for Advanced Packaging," Tescan will present a correlative workflow that connects defect localization, rapid access to regions of interest (ROIs), site-specific sample preparation, and nanoscale characterization.
NewPower Worldwide, one of the electronics industry's fastest-growing distributors, today announced it has expanded its committed credit facility to $750 million, further enhancing its ability to invest in inventory, support customer growth, and capitalize on opportunities across the global supply chain.
Global technology and innovation leader ASMPT will showcase its advanced packaging portfolio at SEMICON Taiwan 2026, taking place from September 2 to 4 in Taipei. At Booth L0716 (TaiNEX 1, Level 4)...
As the power demands for AI servers and racks continue to rise, data center power architectures are moving toward higher voltages and greater power densities. Ryan Chiu, Vice President of Conquer Electronics, noted that the rapid expansion of AI infrastructure is not only reshaping server and power system designs, but also raising the bar for circuit safety and long-term reliability.
As the number of video and information sources in today's workplaces continues to grow, small control rooms, meeting rooms, and multimedia environments often need to connect multiple computers and other AV sources while displaying different types of content across multiple screens...
With an absolute maximum rating (AMR) of 75V, STMicroelectronics' L98GD8E is the only 48V automotive pre-driver to combine compliance with the ISO 21780 standard for 48V electrical systems and eight channels for high-side and low-side driving.
Interested in solving microcrack issues in through-glass via (TGV) fabrication? Want to learn how to supply 1,000 Watts, 1 Volt and 1,000 Amperes electricity to semiconductor IC chips in an AI multichip package while scaling up glass panel sizes? If so, visit iCometrue at Booth M0957, Hall 1, 4F, Taipei Nangang Exhibition Center during SEMICON Taiwan 2026!
The intellectual property dispute between Corning and China-based IRICO has entered a new phase at the U.S. International Trade Commission (ITC), with the focus shifting from the finding of trade secret misappropriation to potential remedies affecting access to the U.S. market.
