Reuters Events is proud to present Momentum AI Asia 2025, a premier conference that brings together Asia's most influential AI leaders to tackle the region's most pressing challenges in AI adoption.Taking place on September 17, 2025, at the Amara Singapore, Momentum AI Asia 2025 will feature an impressive lineup of 30+ executive speakers, including Tom Lue, Vice President of Frontier AI Global Affairs at Google DeepMind, Mihaela Isac, Chief Information Officer at DHL Supply Chain Asia Pacific, Lee Wan Sie, Cluster Director, AI Governance & Safety at Infocomm Media Development Authority (IMDA), and Guy Sheppard, Head of AI Strategy & Adoption at Standard Chartered Bank.The event is designed to provide a platform for AI stakeholders to discuss the latest developments, trends, and strategies in AI, with a focus on maximizing impact and ROI. Attendees will have the opportunity to engage in interactive sessions, roundtable discussions, and networking opportunities with over 300 senior attendees, 82% of whom hold director-level positions and above.The conference agenda will explore key themes, including Regional Collaboration, AI Value and Scalability, AI for Competitive Advantage, and AI Readiness and Robustness. With a focus on delivering actionable insights and tangible takeaways, Momentum AI Asia 2025 is the perfect platform for business leaders to future-proof their AI strategies and unlock collaboration opportunities with the region's AI ecosystem."We're excited to bring together the region's AI thought leaders to share insights, best practices, and innovative approaches to AI adoption," said Paul Jacinto, Senior Project Director, Momentum AI Asia "Our goal is to provide a platform for meaningful connections, knowledge sharing, and collaboration, ultimately empowering businesses to harness the full potential of AI."Visit the website to learn more.

ASMPT will be exhibiting at SEMICON Taiwan from September 10 to 12, 2025. The theme of the presentation at Booth L0716 at Level 4, TaiNEX 1 in Taipei is: "Empower the Intelligence Revolution." This refers to the driving forces for new chip technologies like AI, smart mobility, and hyperconnectivity. As a leading provider of advanced packaging and semiconductor assembly solutions, ASMPT enables its customers to develop cutting-edge AI technologies, supporting both high-performance AI chips that integrate advanced memory technologies like HBM and efficient components for edge devices. ASMPT will showcase three machines at SEMICON Taiwan: the new ALSI LASER Platform, the fine-pitch wire bonding solution AERO PRO, and the SIPLACE CA2 uniting semiconductor and SMT processes.ASMPT will be exhibiting at SEMICON Taiwan from September 10 to 12, 2025.ASMPTThe next-generation LASER platform has been specifically developed to meet the increasingly complex requirements of IDM and Foundry semiconductor companies for laser dicing and grooving wafer materials. This new system with ASMPT's patented multi-beam technology expands the company's portfolio with a focus on front-end operations."The new platform combines high-precision laser processing with smart automation to support the next generation of semiconductor manufacturing", says Patrick Huberts, Head of Business and Marketing at ASMPT ALSI. "It's the ideal platform for applications in advanced packaging, AI, and power automotive. We invite you to join us for the official launch and discover the new machine live at our booth during SEMICON Taiwan."High-performance wire bondingASMPT also introduces its latest high-performance wire bonder at SEMICON: the AERO PRO. Developed for high-density semiconductor designs, this machine delivers the highest bonding accuracy and exceptional speed for wires with diameters of 0.5 mil (≈12.7 µm). Thanks to integrated real-time monitoring and preventive maintenance functions, the system is ideally suited for use in intelligent, networked production environments. To accommodate complex designs such as system-in-package (SiP) and multi-chip modules (MCMs), as well as applications like ball grid arrays (BGAs), land grid arrays (LGAs), memory modules, or quad flat packages (QFPs) with external leads. For uniform 22-µm bond balls, it employs the patented X-POWER 2.0 transducer—a lightweight and vibration-optimized ultrasonic transducer that supports mixed-wire and vertical bonding in bond via array (BVA) technology. Optimized for complex interconnects in memory, microcontroller units (MCUs), and more, ideal for advanced applications such as AI edge devices and automotive systems.Bridging Semiconductor and SMTThe hybrid SIPLACE CA2 placement solution from ASMPT SMT Solutions redefines advanced packaging by uniting semiconductor and SMT processes in a single, high-speed platform. Traditionally, die bonding and SMT placement were separate steps — now, they are seamlessly integrated. Designed for advanced packaging applications in smartphones, 5G, AI, high-performance computing (HPC), and IoT devices, the SIPLACE CA2 processes both SMDs from tape and dies taken directly from sawn wafers. This eliminates the need for expensive die taping, saving up to 800 km of tape annually in 24/7 production, reducing both cost and material waste. With up to 76,000 components per hour (cph) for SMT, 54,000 cph for Die Attach, and accuracy of up to 10nm @ 3σ accuracy, the SIPLACE CA2 delivers high-speed and accuracy — even for advanced Die Attach and Flip Chip applications. A breakthrough buffer system decouples die pickup from placement, solving previous speed limitations. Up to 50 wafers can be managed with just 13 seconds of swap time – unmatched in the industry.The SIPLACE CA2 boosts productivity in advanced packaging by combining classic surface-mount technology with die-attach and flip-chip assembly. ASMPT

As cybersecurity threats continue to evolve, attackers are no longer just targeting applications or operating systems, but are now penetrating deeper into the boot firmware layer of devices, including BIOS, UEFI, and BMC. These firmware components are responsible for initializing and verifying the system integrity during the boot process. Once compromised or embedded with malicious code, they can compromise the entire system.Real-world incidents and attack simulations have shown that firmware attacks are highly stealthy and persistent, often eluding traditional antivirus software and OS-level defenses. The National Institute of Standards and Technology (NIST) addressed this as early as 2018 in the release of NIST SP 800-193: Platform Firmware Resiliency Guidelines, proposing a three-step framework: Detect–Protect–Recover, as the core architecture for platform firmware security.Among these, the"Recover" mechanism has drawn significant attention. It not only mandates that a system halt upon detection of firmware anomalies, but also be capable of restoring original firmware from a secure image (such as a Golden Image)—automatically, without human intervention—thus ensuring the platform can return to a trusted state and cutting off any potential long-term malware residency.To learn the latest cybersecurity regulations and trends, download the hardware security whitepaper for free.Challenges in PFR Adoption: Legacy Architectures and Weak Firmware VerificationAlthough NIST SP 800-193 is widely recognized as a reference for governments and enterprises implementing firmware security, the practical deployment of PFR (Platform Firmware Resiliency) still faces numerous hurdles.First, many embedded systems or server platforms rely on conventional SPI NOR Flash as firmware storage, which lacks support for key-based verification, partition control, and redundancy mechanisms, making it difficult to meet the "Protect" and "Recover" requirements defined by NIST. Even when the platform includes a Root of Trust (e.g., TPM, CPLD, BMC), vulnerabilities remain if the external memory used does not support secure image switching or key-binding mechanisms.Common challenges include:Firstly, firmware regions vulnerable to rollback attacks, where outdated, exploitable images are reintroduced. Secondly, the inability to separate access rights between boot-time and run-time, leading to broken access control. Thirdly, the lack of integrated verification tools and APIs requires extensive engineering effort to build verification workflows.Unnder these conditions, the search for a secure storage component that supports the PFR framework has become a critical entry point for enhancing firmware security.Winbond TrustME Secure Flash — W77Q: A Secure Memory Fully Supporting PFRTo address the above challenges, Winbond's TrustME Secure Flash — W77Q series offers a solution specifically designed for platform firmware security and recovery. It allows for fast deployment of the NIST PFR-required protection and automatic recovery features without altering the main platform architecture.Dual Images with Secure Verification—Seamless Auto-Recovery DeploymentThe W77Q integrates both a Primary Image and a Recovery Image, supporting secure verification mechanisms and auto-switching logic. When the primary firmware image is corrupted or fails verification, the Root of Trust controller (e.g., BMC or CPLD) can trigger a switch to restore the system to the Golden Image. This entire process requires no additional software or CPU intervention, fulfilling the "unattended, automatic recovery" requirements of PFR.Moreover, the mechanism complies with the Detect-Protect-Recover architecture outlined in NIST SP 800-193, and can be integrated with major platform vendors' boot verification logic, establishing a full Chain of Trust from chip initialization to firmware validation.Multi-Level Access Control and Key Binding to Strengthen Firmware IntegrityW77Q supports partitioning and key-based access control, allowing different keys and permissions to be configured for each firmware region (e.g., Bootloader, UEFI, BMC). This prevents unauthorized access and tampering. It also supports rollback prevention and restricts firmware updates to authorized controllers only, significantly reinforcing platform firmware integrity verification.Modular Integration and Development Support—Accelerating PFR ImplementationThe W77Q Secure Flash not only strengthens hardware-based firmware protection but also provides complete software development and validation support to help device manufacturers accelerate PFR deployment:Offers ready-to-integrate verification API interfaces and reference designsProvides boot verification parameters and switching logic in coordination with Root of Trust controllers (e.g., BMC, CPLD)Delivers test reports and certification documents compliant with NIST SP 800-193 and ISO 26262The Winbond W77Q Secure Flash is pin-to-pin compatible with existing SPI Flash devices, requiring no hardware changes, greatly reducing implementation costs.For applications like server motherboards, 5G base stations, industrial control systems, or automotive ECUs, W77Q presents an ideal solution for quickly realizing platform firmware recovery mechanisms and meeting security compliance requirements.To learn more about Winbond's advanced security solutions, visit Winbond's website or contact Winbond directly, or download the latest Hardware Security White Paper.

SK hynix Inc. announced today that it has completed development of its 321-layer 2Tb QLC NAND flash product and has begun mass production. This achievement marks the world’s first implementation of more than 300 layers using QLC technology, setting a new benchmark in NAND density. The company plans to release the product in the first half of next year following completion of global customer validation.1NAND flash is categorized as single-level cell (SLC), multi-level cell (MLC), triple-level cell (TLC), QLC, and penta-level cell (PLC) depending on how many data bits can be stored in one cell. As the amount of information storage increases, more data can be stored in the same volume.To maximize the cost competitiveness of its new product, SK hynix developed a 2Tb device with double the capacity of existing solutions. To address potential performance degradation in large-capacity NAND, the company increased the number of planes, independent operation units within a chip, from 4 to 6. This enables greater parallel processing and significantly enhances simultaneous read performance.2A plane refers to a cell and its peripheral circuitry that can operate independently within a single chip. By increasing the number of planes from 4 to 6, the simultaneous read performance of the chip—a key factor in data processing—is significantly improved.As a result, the 321-layer QLC NAND delivers both higher capacity and improved performance compared to previous QLC products. Data transfer speed has doubled, write performance has improved by up to 56%, and read performance has improved by 18%. In addition, write power efficiency has increased by more than 23%, strengthening competitiveness in AI data centers where low power consumption is critical.The company plans to apply its 321-layer NAND first to PC SSDs, before expanding to enterprise SSDs (eSSD) for data centers and UFS for smartphones. Leveraging its proprietary 32DP3 technology, which enables the simultaneous stacking of 32 NAND dies in a single package, SK hynix aims to enter the ultra-high-capacity eSSD market for AI servers by achieving twice the integration density.332DP (32 Die Package): A method of simultaneously packaging 32 dies in one package to increase chip capacity.“With the start of mass production, we have significantly strengthened our high-capacity product portfolio and secured cost competitiveness,” said Jeong Woopyo, Head of NAND Development at SK hynix. “We will make a major leap forward as a full-stack AI memory provider, in line with the explosive growth in AI demand and high-performance requirements in the data center market.”SK hynix begins mass production of the world’s first 321-layer QLC NAND flash chip with 2Tb capacity. SK hynix

DEKRA's Automotive EMC Laboratory in Taiwan has been officially approved by Stellantis, making it the third DEKRA site worldwide alongside Italy and Korea. This milestone underscores DEKRA's pivotal role in the global automotive EMC testing landscape.Stellantis, one of the world's largest automotive groups, operates a rigorous laboratory approval program to ensure partners meet the highest technical standards. With this approval, DEKRA Taiwan is now authorized to provide EMC testing for 16 Stellantis brands, including Chrysler, Citroen, Fiat, Opel, and Peugeot. The recognition allows DEKRA to deliver reliable EMC testing support to the global supply chain, helping OEMs and suppliers accelerate product validation, reduce time-to-market, and benefit from localized expertise in the Asia-Pacific region.The Stellantis approval adds to DEKRA's extensive portfolio of OEM recognitions worldwide. In Taiwan, DEKRA's Automotive EMC Laboratory is also approved to provide testing services for GM, Volkswagen, and Jaguar & Land Rover. Meanwhile, DEKRA Korea's EMC Laboratory is recognized by Ford, GM, and Stellantis. Together, these approvals highlight DEKRA's breadth and depth in serving global automotive manufacturers, and reinforce the group's ability to combine its worldwide laboratory network with regional expertise to provide comprehensive local support."We are honored to receive Stellantis' recognition. This approval is a strong endorsement of our team's expertise and commitment, and it empowers DEKRA Taiwan to better support customers in automotive electronics, intelligent mobility, and electric vehicles. Our focus is on helping supply chain partners speed up validation, shorten time-to-market, and strengthen their global competitiveness," said Aaron Lee, Managing Director of DEKRA Taiwan.DEKRA Taiwan's Automotive EMC laboratory has developed a strong reputation for serving international OEMs, with capabilities spanning intelligent transportation systems, wireless communication, and electric vehicles. The new Stellantis approval further strengthens its strategic role within DEKRA's global laboratory network and ensures full alignment with international technical standards.Beyond individual testing projects, DEKRA delivers comprehensive one-stop EMC services. These include EMC testing, wireless certification, OEM specification verification, and Global Market Access (GMA) support. With combined automotive and military EMC testing capabilities, DEKRA helps clients efficiently meet OEM requirements, streamline validation, and accelerate entry into global markets.DEKRA Taiwan's Automotive EMC Laboratory, approved by Stellantis, supporting EMC testing for global automotive OEMs.

With the widespread adoption of AIoT (Artificial Intelligence and Internet of Things) applications—from smart home devices to smart manufacturing, connected vehicles, smart cities, infrastructure and defense systems—the reliance of digital devices on flash memory for code storage has rapidly expanded. Memory is no longer just a medium for data storage; it now serves as the carrier for firmware, the repository for AI models, and the guardian of identity and authorization data. Ensuring security of flash memory directly determines the trustworthiness of the devices themselves.Risks from Real World Applications-A smart doorbell was compromised and used for remote surveillance of households by hackers.-A smart camera product line was infected with malware due to poor memory protection, causing large-scale corporate network breaches.-A battlefield drone was hijacked. Investigation revealed its unprotected flash memory exposed flight parameters and credentials.When memory becomes the convergence point for both data and instructions, a single breach can collapse all layers of defense.The Changing Role of Memory in AI SystemsThe introduction of AI, especially in edge devices, has made the role of memory even more critical. Today, memory not only stores data but also holds AI model parameters and behavioral decision logic. The requirements for memory integrity and non-repudiation have increased significantly. If AI models are tampered with, it can lead to erroneous decisions or even malicious behavior.Moreover, AI-driven real-time responses demand that memory supports lower latency and higher confidentiality. Traditional security designs focused solely on data protection can no longer meet the needs of modern devices.The Challenge of Compliance and the Surge of StandardsGlobal regulations around IoT and industrial device cybersecurity are intensifying. The EU's Cyber Resilience Act, the U.S. IoT Cybersecurity Improvement Act, ISO 21434 for automotive systems, and IEC 62443 for industrial control systems all require strong confidentiality and data integrity—even at the memory level. Flash memory must now address both functional safety and cybersecurity challenges.To learn the latest cybersecurity regulations and trends, download the hardware security whitepaper for free.Rethinking Memory Security AssumptionsHistorically, memory was treated as a peripheral component, with security left to the main controller. But today's attackers use physical access tools, firmware injections, and interface-level attacks to exploit memory. Flash memory must now adopt active defense mechanisms, including:- Hardware-level access control- Data encryption and firmware authentication- Event logging and anomaly detection- Logic-level separation and multi-factor verificationRedefining the Role of Secure Flash MemoryTo truly counter next-generation risks, flash memory should integrate secure logic circuits, providing secure boot, firmware authentication, key management, encryption engines, and access control. Such designs greatly reduce the risk of edge devices being compromised, controlled, or having their data stolen.In product design, special emphasis shall be placed on the concept of 'establishing a root of trust' through Secure Boot and key storage mechanisms. This ensures that every device boot starts from trusted code, preventing malicious firmware implants. Key storage shall be implemented in a pure hardware architecture, isolating sensitive information in inaccessible secure zones, significantly enhancing both physical and logical security.For firmware security, compliance to firmware authentication and resilience design standards such as NIST SP 800-193. This means not only verifying firmware integrity at boot, but also automatically recovering to a safe state in the event of an attack or anomaly, ensuring continuous device operation and protection from malicious software.Furthermore, secure storage solutions shall use a pure hardware architecture, requiring no external software or controller assistance, maintaining high security and performance even in harsh environments.To address supply chain security challenges, advanced digital signature technology is needed, ensuring that every firmware and software update from the manufacturer to the end device can be verified for source and integrity, providing comprehensive secure supply chain support.To meet post-quantum threats, advanced encryption standards such as CNSA 2.0 (Commercial National Security Algorithm Suite 2.0) compliance is necessary, ensuring that the software update architecture complies with the latest international cybersecurity regulations and meets the needs of high-security applications in government, defense, and automotive sectors.Winbond W77Q / W77T Secure Solutions and Industry PracticeAs a provider of secure logic circuit flash memory solutions, our products have been successfully adopted across diverse applications, including computer peripherals, video conferencing equipment, servers, AI edge servers, and automotive modules. Our designs maintain logical compatibility with existing market architectures to ensure smooth integration and low migration cost.Our solutions integrate LMS (Leighton-Micali Signature) advanced digital signature technology for PQC (post-quantum cryptography) needs.Our security architecture is also certified under leading global standards including Common Criteria (CC), FIPS 140-3, SESIP, PSA, IEC 62443, ISO 21434, and ISO 26262—offering customers a reliable and future-ready foundation.Safeguarding Human-Centered Trust at the Technological EdgeIn the AIoT era, memory security is no longer just about storage—it is the foundation of system-wide trust. From household devices to tactical drones, memory holds more than data; it protects privacy, drives enterprises, and underpins societal resilience.As a Secure Flash Memory solution provider with dedicated logic design, we understand the profound responsibility behind technology. Our solutions offer downward compatibility with mainstream architectures, while meeting stringent global security standards.True innovation is not just about what we can do—but what we can trust. We are committed to embedding security into every smart node and collaborating with partners, developers, and standards bodies to ensure technology continues to serve human values.To learn more about Winbond's advanced security solutions, visit Winbond's website or contact Winbond directly, or download the latest Hardware Security White Paper.

xMEMS Labs, the global leader in solid-state MEMS speakers and micro-scale thermal solutions, today announced the return of its highly anticipated xMEMS Live Asia seminar series, taking place September 16 in Taipei and September 18 in Shenzhen.Now in its third year, xMEMS Live Asia brings together engineers, product designers, system architects and company executives to explore how MEMS-based audio and active thermal management technologies are redefining the design and performance of next-generation AI interface devices – from AI glasses, smartphones, headphones and earbuds to SSDs, optical transceivers and rack servers in the data center.This year's one-day seminars will center on live product demonstrations of Sycamore, xMEMS' revolutionary thin and lightweight full-range MEMS loudspeaker, and cooling, the world's first solid-state air pump-on-a-chip delivering active thermal management in devices where conventional fans can't go.Attendees will experience:1) AI glasses featuring Sycamore speakers and cooling for discreet, high-fidelity sound and heat management in ultra-thin eyewear2) Next-gen headphones featuring full-range Sycamore, paired with cooling to deliver the world's first active earcup ventilation3) SSD thermal management featuring cooling for higher sustained data transfers4) Plus a smartwatch with Sycamore, TWS earbud solutions with Cypress and Lassen, and thermal demos showcasing cooling at both chip and system levelsIn addition to hands-on demos, the seminar features deep-dive technical sessions from xMEMS engineers, covering performance testing, system integration, and product optimization for Sycamore and cooling across a variety of applications. Dedicated sessions on headphone and TWS implementations will offer further insight into how xMEMS solutions deliver superior fidelity, form factor reduction, and system-level benefits for consumer electronics."AI is changing how we interface with devices while also increasing processor and thermal loads," said Joseph Jiang, CEO of xMEMS Labs. "At xMEMS Live Asia, we'll demonstrate how Sycamore and cooling technologies are enabling a new generation of thinner and lighter-weight conversational AI interfaces and active thermal management for improved on-device intelligence and system performance."Registration is now open. Seating is limited. Click here for English, here for Simplified Chinese, or here for Traditional Chinese. Reserve your spot today to experience the future of conversational AI interfaces and AI thermal management!For more information about xMEMS and its solid-state solutions, visit xmems.com.Showcasing Live Demonstrations of AI Interface and Thermal Device Innovation Enabled by Sycamore and cooling on September 16 in Taipei and September 18 in Shenzhen.

Power modules have undergone a significant transformation- from simple power sources into critical enablers of system scalability, performance, and energy efficiency. This evolution is driven by the increasing demand for energy resilience, industrial transformation and enhancement. MEAN WELL, the global leader in standard power supply solutions, will adopt an application-oriented approach and work in close collaboration with distributors to showcase the effectiveness of their diversified product portfolios in practical applications at the upcoming Automation Taipei 2025.Partnering with distributors to develop complete solutions for automation, green energyTony Hsieh, Section Manager of MEAN WELL's Technical Service Center, indicated that the company's focus at this exhibition is on automation and green energy applications. Distributors will leverage their expertise in automation applications to incorporate MEAN WELL's green energy and backup power products.Hsieh further noted that the company's product designs follow cross-industry standards, efficiently fulfilling the application requirements of distributors in their specific sectors. In the field of humanoid robotics, MEAN WELL provides an array of charging power options, including wall-mounted designs, high-power density models, and fanless or fan-equipped configurations. These technologies can be easily adapted for various scenarios, including outdoor applications. Moreover, they support CAN bus communication and system-level integration, ensuring a stable power supply.The characteristics offer a broader range of collaborative models between MEAN WELL and its distribution partners. Partners leverage their technical expertise and capabilities to integrate MEAN WELL's standard products and related components as a foundational element in their offering, in addition to traditional product sales. Furthermore, by applying their professional integration capabilities—tailored to specific application scenarios—they co-develop comprehensive solutions that deliver significant added value.At Automation Taipei 2025, factory automation specialist YAU-YIH Enterprise will present a complete industrial robotic arm display solution powered by MEAN WELL's automation-oriented power supplies. RiKO, specialist in smart lighting control, will showcase the integration of MEAN WELL's Matter wireless and DALI wired dimming controllers with its proprietary sensors for use in industrial and commercial automation scenarios. JIDIEN will exhibit its most recent XDR and XTR series DIN-rail power supplies, as well as the next-generation mobile energy storage system, the NTN-5K, highlighting its advancements in energy storage applications and power integration.MEAN WELL's distributors will present backup power solutions for energy applications. Integrating redundant power supplies with control modules allows automation systems to securely retain operational progress, document work steps, and ensure a consistent power supply during outages, thereby reducing equipment loss and downtime expenses.Hsieh stated that MEAN WELL's target applications prioritize energy conservation, green energy and smart systems. These technologies prioritize high-efficiency energy conversion, support a variety of communication protocols, and enable remote monitoring. They can be integrated with other products to enhance energy storage and feedback systems in both grid-connected and off-grid setups, effectively fulfilling the stability and intelligent energy demands of modern automation systems. This presentation leverages distributors' expert integration capabilities, combining MEAN WELL power modules with green energy and backup products to create a unified system that provides significant value-added services to end customers.The simultaneous release of key products aims to greatly improve industrial control and energy storage applications solutionsMEAN WELL will exhibit a variety of key products at this exhibition, in addition to the two target applications. These products include the XDR series DIN-rail power modules, the BIC-2200 bidirectional power supply, the LOP-200/300 ultra-thin PCB power supplies, and other solutions that have garnered significant industry attention.The XDR, XDR-E, and XTR represent significant enhancements to MEAN WELL's DIN-rail power supply product line, effectively tackling spatial limitations, thermal management, and communication needs within the industrial and automation sectors. The three products are distinctly categorized: the XDR serves as the premium flagship with superior performance and extensive communication capabilities; the XDR-E presents a budget-friendly alternative; and the XTR accommodates three-phase input, rendering it appropriate for substantial loads and extended usage. series can function at full capacity at 60 degrees Celsius. These products meet international safety standards such as CB, TUV, UL, CE, and UKCA, with some models offering explosion-proof and maritime safety certifications.The BIC-2200 is a bidirectional AC/DC power supply designed to support various energy storage applications by facilitating both charging and discharging operations. It can be paralleled with a maximum of five units for a total output of 11kW, delivering 2200W of power per unit in a 1U ultra-slim rack-mount design. It possesses a bidirectional conversion efficiency of 93% and switching rates of one millisecond. Furthermore, it has an optional CAN bus interface for connection with energy management systems. This product is TUV/UL 62368-1 and CE certified, and adheres to the IEC 62477-1 grid-connection standard. It includes comprehensive protective measures, including islanding protection, overvoltage, overload, short-circuit, and overtemperature safeguards, rendering it appropriate for battery manufacturing and energy scheduling applications like vehicle-to-vehicle (V2G) systems.The LOP-200/300 series is an ultra-thin, high-power PCB-mounted power supply, measuring 4×2×1 inches and around 25mm in thickness. They are offered in 200W and 300W variants, featuring a maximum output capacity of 150% and an output voltage range of 12-54V. They can operate reliably at altitudes of up to 5,000 meters and within a temperature range of -40 to 80 degrees Celsius. The LOP-200/300 series has obtained numerous international safety certifications, including IEC 62368-1, IEC 60601-1, and IEC 61558-1/60335-1. They demonstrate a conversion efficiency of up to 94%, and a leakage current of 500µA, and an integrated auxiliary power supply of 12V/0.5A. The entire series comes with a three-year warranty.Product and application solution partner: MEAN WELL and distributors building a complete value chainAt Automation Taipei 2025, MEAN WELL will present the outcomes of its strategic evolution into a comprehensive product and application solutions partner. Distributors can leverage their specialized expertise, together with MEAN WELL's extensive standardized product line, to create a full value chain from product to application. Hsieh indicated that driven by a triadic strategy of module standardization, application orientation, and customization support, MEAN WELL is moving beyond the traditional role of a power supply manufacturer and evolving into an application-driven power solution partner. In the future, MEAN WELL will enhance its flexible integration and application extension capabilities across automation, energy storage, AI computing, medical care, and high-density equipment. Through close collaboration with industry partners, the company aims to deliver efficient, safe, and stable smart solutions.Caption: XTR Series Ultra-Thin, High-Efficiency, and Durable DIN Rail Power Supply.Caption: XDR-E Next-Generation Ultra-Thin DIN Rail Power Supply.

Taiwan has officially transitioned into a super-aged society. The swiftly increasing older demographic and the labor force deficit have resulted in a significant scarcity of nursing personnel. By 2030, it is projected that the global demand for nursing personnel will rise by 5.5 million to 7.4 million, necessitating an increased patient care burden on medical professionals.Simultaneously, the quality standards of contemporary medical care are perpetually advancing, while the nursing operational procedures have become increasingly intricate and burdensome, hence augmenting the workload and time constraints faced by nursing personnel. Confronted with multiple problems, medical institutions must devise ways that sustain high-quality care while alleviating the pressure on nursing personnel. In response, Far Eastern Memorial Hospital (FEMH) implemented the ASUS VivoWatch smart band to significantly enhance nursing efficiency and service quality.The aging population affects medical care: Smart wearables helpLiu, Cai-wen (transliterated from Chinese), supervisor of the FEMH Nursing Department, stated that the ASUS VivoWatch, a wearable produced by ASUS, can automatically measure patients' vital indicators such as heart rate, blood pressure, and blood oxygen levels. It transfers this data to the hospital system in real time using its built-in Bluetooth module, allowing for continuous 24-hour physiological monitoring. Furthermore, the device boasts a pleasant and lightweight design, suitable for extended usage, which can substantially reduce discomfort and limit interference with patients' daily activities. The FEMH Information Technology Department has partnered with the ASUS team to link the wearable device to the hospital's information system, incorporating it with the early warning system to provide an automated health risk assessment process. Upon detecting abnormal vital signs in a patient, an alert notification can be promptly generated to improve care response efficiency and ensure patient safety.Liu stated that this solution effectively addressed numerous clinical pain points. Firstly, nursing workers are no longer required to measure physiological data during the night to prevent disrupting patients' sleep. Secondly, the wearable device autonomously captures physiological data, alleviating the burden on nursing staff regarding manual measurement and documentation; thirdly, high-frequency automatic monitoring, in conjunction with an early warning system, facilitates the medical team in identifying early indicators of deteriorating conditions, thereby enhancing patient safety. This smart wearable is being utilized in the VIP and general acute wards at FEMH, serving inpatients aged 18 and above. An Institutional Review Board (IRB) has authorized the assessment of the proposal's ethical criteria and safety.Clinical advantages are reinforced in a variety of ways, resulting in a win-win situation for both patients and nursesThe efficiency of FEMH nursing operations has been substantially improved by the implementation of ASUS VivoWatch wearable devices. The automated measurement and data recording capabilities allow nursing staff to focus on patient care and emergency interventions, thereby achieving the objective of "minimizing pressure and workload." The ASUS VivoWatch wearable is seamlessly incorporated with the EWS system, allowing the nursing team to promptly identify abnormal patient signs. This integration reduces the occurrence of abrupt deterioration incidents and improves patient safety. The real-time update function of physiological data boosts the quality of care by enhancing the speed and accuracy of decision-making for the medical team. Additionally, patients are less frequently disturbed during sleep by traditional measurement methods, which strengthens hospital comfort and recovery outcomes.Liu noted that FEMH and ASUS will continue to expand the use of the wearable device across wards and for patients with various diseases, while also improving technology integration. Simultaneously, they will promote the standardization of smart care by using technology to simplify consistent nursing operational procedures, so boosting overall medical service quality and the hospital's potential for long-term development. It is hoped that by combining clinical nursing experience with technical innovation, we would be able to handle the caregiving challenges posed by an aging population and attain the long-term care aim of "nursing personnel and technology collaborating," Liu concluded.

Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join SEMICON Taiwan held at Taipei Nangang Exhibition Center, Hall 1 - 1F from September 10-12, 2025. Visit TRI's Booth No. K3070 to learn more about the latest Advanced WLP/PLP and SEMI Back-End Package Inspection and metrology solutions.TRI's Inspection and Metrology Applications include: Chiplet & Chip-on-Wafer (CoW), System-in-Package (SiP), Advanced WLP, TSV Metrology, μBump, Cu Pillar, Surface Topology, Profiling, Thin Film Thickness, Patterned Wafer, Inner Crack/Chipping, After Sawing Defects, Die Underfill, Glue, Epoxy & Flux, Wafer Bumping and Die / Wire Bonding.TRI will showcase the Wafer Inspection and metrology Platform, TR7950Q SII, capable of wafer macroscopic 3D inspection and micro measurement metrology. The TR7950Q SII has applications in Advanced WLP, Wafer Frame, Patterned Wafer, Wafer Bumping, WLCSP, Through Silicon Via (TSV), thin film, and more.TRI will also exhibit the back-end inspection solutions, the TR7007Q SII-S for C4 bumps (~100 μm Ø), Mini-LED, and 008004 paste inspection applications, and the TR7900Q SII-R TRI's Reject Station with A-Powered 3D Inspection that can inspect die, wire diameters of up to 15 μm (0.6 mil), SiP, underfill, bumps, and more. The lineup will also include an X-ray Inspection Demo Station. TRI's SEMI AXI solutions can inspect C4 bumps and Cu pillars.