Skyted presents its new software, Sound Bubble, allowing users to visualize how far their voice can be understood or perceived by people sitting next to them.At CES 2026 in Las Vegas, Skyted unveils the Sound Bubble App, a simple and intuitive tool designed to help Skyted 320 headset users understand and control their real-time speech privacy. With clear visual indicators and guided adjustments, the app enables users to protect their privacy, monitor their speech range, and remain discreet in any environment.Real-Time Privacy VisualizationThe Sound Bubble app guides users in regulating their voice during calls. By adjusting their speaking level, they can see in real time whether their words remain confidential to the person sitting next to them. The Skyted 320 headset continuously adapts the user's voice so it stays clear and intelligible for the person on the other end of the call, while remaining imperceptible to those nearby.The Skyted 320 HeadsetThe Skyted 320 is the first headset that makes private conversations truly possible in public spaces. Whether on a train, in an airplane, or in a restaurant, it allows users to speak freely without being overheard or disturbing those around them.Presented successfully at CES Las Vegas, Mobile World Congress, and VivaTech 2025, the Skyted 320 introduces a new way to communicate - combining clarity, discretion, and comfort. Its microphone captures your voice perfectly, ensuring your caller hears 100% of your speech even when you speak softly, while your neighbors hear 0% of your conversation.The Skyted 320 is available for purchase directly on the company's website.
Portwell, Inc., a leading provider of industrial and embedded computing solutions and a subsidiary of Posiflex Technology Inc., today announced its strategic investment in Wincomm Corporation, acquiring a 41% ownership stake and becoming its major shareholder.Wincomm Corporation, headquartered in Hsinchu, Taiwan, is a well-established innovator in the touchscreen computer market, with a strong foothold in medical equipment, smart healthcare and industrial automation sectors. Its diverse Human-Machine Interface (HMI) computer and display portfolio includes medical-grade panel PCs, embedded touch displays, and peripherals, as well as rugged industrial-grade solutions such as wide-temperature and high-brightness panel PCs, waterproof stainless-steel displays, and IECEx, ATEX, C1D2/C2D2-certified explosion-proof panel PCs."This investment marks a significant milestone in Portwell's growth direction," said Ken Guan, President of Portwell, Inc. "By joining forces with Wincomm, we are not only reinforcing our presence in the medical computing space but also expanding our capabilities across factory automation, petrochemical, and military applications. The synergy between our product lines and business models will enhance our overall competitiveness and customer satisfaction, while driving innovation in Edge AI and embedded computing."
Mobilint, a South Korean fabless AI chipmaker, announced that it will showcase its efficient and production-ready industrial edge AI processors and their real-time demonstrations at CES 2026, to be held from January 6 through 9 at the Las Vegas Convention Center.MLX-A1, the company’s standalone edge AI box, was recently named a CES 2026 Innovation Award Honoree in the Artificial Intelligence category. The compact 1.3 kg system was recognized for its ability to run advanced AI workloads locally - including language, vision, and multimodal models - within a 70-watt, laptop-class power envelope, without relying on cloud services, servers, or GPUs. By addressing latency, power consumption, cost, and data privacy challenges, MLX-A1 enables practical AI deployment across industrial environments.Designed for flexible integration, MLX-A1 supports both retrofitting existing equipment and deploying new production lines without added infrastructure complexity, while delivering meaningful power and cost savings.MLX-A1 is powered by ARIES, Mobilint's high-efficiency AI accelerator chip, capable of delivering up to 80 TOPS of performance. ARIES entered mass production in 2024 and is now shipping globally in multiple form factors, supporting scalable deployment across industrial and commercial systems.Mobilint will also present REGULUS, its ultra-compact AI system-on-chip that won the CES 2025 Innovation Award, during the exhibition. Measuring 17 mm × 17 mm, REGULUS delivers up to 10 TOPS of AI performance at under 3 watts, enabling always-on, on-device AI in space- and power-constrained environments such as smart sensors, embedded vision systems, and low-power industrial devices.Throughout CES 2026, Mobilint will run live, application-focused demonstrations showcasing real-time video analytics, local AI assistants, and multi-model AI processing executed directly on its hardware. These demonstrations emphasize low-latency inference, stable real-time operation, and energy efficiency.In addition, Mobilint will feature joint demonstrations with global industrial platform partners including Lanner and Autonics, highlighting how its AI processors can be integrated into existing systems with minimal modification, enabling AI upgrades without full system replacement."CES 2026 gives us the opportunity to demonstrate our edge AI technologies that are ready for immediate deployment in real industrial settings," said Dongjoo Shin, CEO and CTO of Mobilint. "By combining high-performance, power-efficient AI processing technology with close collaboration with global partners, we will further accelerate AI adoption across industries and continue to strengthen our technological competitiveness in the global market."Visitors can experience Mobilint's CES Innovation Award–winning MLX-A1, REGULUS, and its latest edge AI hardware at Booth No. 9129 in the North Hall, LVCC, during CES 2026.
At CES 2026, DEEPX will present a new paradigm for AI infrastructure - one designed for the physical world. As AI expands beyond data centers into robots, mobility, smart cities, factories, and intelligent devices, DEEPX positions itself at the core of this transformation with energy-efficient, real-time AI semiconductors purpose-built for Physical AI.Much like Arm reshaped the CPU industry through low-power innovation, DEEPX aims to establish a new global standard for Physical AI by delivering ultra-efficient AI accelerators. DEEPX enables intelligence to operate reliably and sustainably in real-world environments, addressing the critical constraints of power, heat, and cost.DEEPX's technology leadership has already been validated in the global market. In addition to winning two CES Innovation Awards in the Computing Hardware and Embedded Technologies categories, DEEPX-powered solutions have achieved the industry's highest recognition. Notably U.S.-based partner Sixfab received the CES Best of Innovation Award for its ALPON X5 AI Gateway, powered by DEEPX's first-generation AI chip, DX-M1. This success serves as a testament to DEEPX's solutions being more than just a component supply; they are recognized as a core engine and a game changer that elevates global partners' products to a world-class level.DEEPX will host a dedicated booth at the Las Vegas Convention Center (LVCC), North Hall – AI & Robotics Zone (#8945). The exhibit will showcase real-world deployments of AI semiconductors across robotics, drones, factory automation, retail, and intelligent infrastructure, proving that Physical AI has moved beyond concept and into commercial-scale deployment.At the booth, DEEPX will showcase performance targets for its next-generation DX-M2 AI chip, built on an advanced 2nm process. The DX-M2 is designed as a foundational infrastructure chip for the Physical AI era, solving the fundamental power and scalability limitations of data-center-centric architectures.Furthermore, DEEPX will launch its Open-Source Physical AI Alliance, formed in collaboration with leading AI software ecosystems including Baidu PaddlePaddle and Ultralytics' YOLO community. This initiative reflects DEEPX's strategy to tightly integrate hardware and software, accelerating global adoption of Physical AI through open, developer-friendly platforms."CES 2026 marks a pivotal moment for DEEPX - not just showcasing technology achievements, but demonstrating how Physical AI becomes real infrastructure through global partnerships,"said Lokwon Kim, CEO of DEEPX.
Himax Technologies, Inc. announced that its subsidiary Liqxtal Technology, in collaboration with iCatch Technology, Inc., will jointly showcase its latest Drone AI Imaging Solution at the upcoming CES 2026, the largest consumer electronics show in Las Vegas, U.S.A. from January 6 - 9, 2026. The solution integrates Liqxtal's long-range electro-optical (EO) and thermal IR camera system, with iCatch's high-performance image processing and edge AI SoC serving as the core computing platform. This highly integrated architecture significantly reduces system complexity while ensuring data security and privacy. The Drone AI imaging solution delivers stable, high-efficiency AI visual processing for drone applications, targeting high-growth markets including aerial photography, security surveillance, and industrial inspection. For the showcase at CES, on the optical side of the Drone AI imaging solution, the system integrates Liqxtal's ultra-lightweight camera module, combining EO with up to 20 times optical zoom capability and thermal infrared (IR) imaging. This design delivers stable performance across daytime, nighttime, and low-visibility environments, while significantly enhancing aerial target detection and tracking. Featuring a lightweight design and high level of integration, Liqxtal's dual-spectrum long range EO and thermal IR camera modules are well suited for applications such as real-time image recognition, dynamic target tracking, and all-weather, around-the-clock monitoring. On the AI computing side, the newly introduced solution is powered by iCatch's advanced edge-AI vision SoC, delivering up to 4 TOPS (4 trillion operations per second) of AI computing performance, making real-time, on-device image analysis and object recognition possible, thereby significantly reducing reliance on cloud computing, while improving system responsiveness and minimizing latency and data-transmission overhead. In addition, iCatch's SoC integrates a suite of stable image-processing technologies, including electronic image stabilization (EIS), ensuring clear and stable image quality even in high-dynamic or complex flight environments.The newly launched Drone AI imaging solution also supports a wide range of mainstream communication interfaces and standard protocols, such as USB3.0, Ethernet and more, enabling flexible integration across various drone platforms. This versatility allows the solution to meet customized requirements for diverse applications including aerial photography, security and surveillance, and industrial inspection applications, while helping system integrators and end customers accelerate product deployment and real-world adoption. "Our collaboration with Liqxtal validates the platform value of iCatch's Vision System Solution. As physical AI applications continue to grow rapidly, iCatch integrates high-performance image processing with edge-AI computing to deliver a production-ready, deployable "The eyes of AI," helping customers reduce integration risk, shorten time to deployment, and accelerate commercialization," said Weber Hsu, President of iCatch. "This collaboration fully leverages Liqxtal's expertise in optics and imaging system integration, together with iCatch's strengths in edge-AI computing and intelligent image processing, enable high level of integration between optical imaging and AI vision processing, further expanding application scenarios such as drone/UAV (unmanned aerial vehicle) aerial photography and industrial remote inspection," said by Dr. Hung Shan Chen, President of Liqxtal.Liqxtal and iCatch invite all interested parties to experience the latest dual spectrum Drone AI imaging solution at Venetian Expo, Titian 2201A, Las Vegas. To schedule a meeting or booth visit, please contact Liqxtal at info@liqxtal.com or iCatch at ir@icatchtek.com.
