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    Huawei reportedly backs 12-inch DRAM fab to reduce memory dependence
    6min ago
    Applied Materials India eyes larger role in global chip equipment development
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    AI, LEO, and broadband upgrades lift Taiwan networking makers
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    US chip factory buildout faces possible delays as labor shortage nears 157,000 by 2030
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    Exclusive: China's notebook ODMs are closing in fast on Taiwan's manufacturing crown
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    CPO mass production accelerates new four-stage test equipment market
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    Nanya lifts long-term capacity to 50%, eyes 4x capex in 2027
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    Infineon urges TSMC to consider a second Dresden fab as demand outlook evolves
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    MULTIMEDIA
    Jensen Huang in Seoul: Faker, BBQ and one very awkward LG chairman
    PRNEWSWIRE
    From AI Computing Infrastructure to Computing Security, Shenzhou Guangda and PICC P&C Beijing Branch Build a New AI Infrastructure Ecosystem
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