GoldTek, a supplier of customized portable devices, is displaying its smart wearable device, smart household appliance and rugged handheld devices at Computex 2014. Of the products, the most eye-catching one on display is the multi-function smart sport watch, Ranger Watch, which features a brand-new design, high compatibility and stable operation.GoldTek has been developing customized portable/rugged devices for years, and has been cooperating with Microsoft, Google, Samsung and NEC. It provides one-stop services, covering software development, PCBA assembly, PCB board level design services, turn-key solutions such as ID/ME design, hardware/software development, reliability tests, manufacture and EMC/Safety certification tests. Flexibility makes GoldTek a reliable partner.With years of experiences in customized services, GoldTek is presenting three kinds of products at Computex.Ranger WatchThe GoldTek Ranger Watch is compatible with Android/iOS systems. It is capable of recording and analyzing sports data, uploading data to smartphones and PCs, receiving SMS and social networking messages and showing caller IDs. Its G sensor, electronic compass and barometric altimeter are able to record precise sports details, such as the movement distance, height of climbing and effective pace. Moreover, it is equipped with a high capacity lithium battery and a loss reminder design.GoldTek's multi-function smart sports watch, Ranger WatchPhoto: CompanySmart PlugGoldTek's Smart Plug can link with smart mobile devices through GoldTek's exclusive Smart Device App, so users can control their household appliances, such as TVs, air conditioners, refrigerators, through the Access Control System. It also has the ability to cut off the power supply instantly through the Remote Monitoring System, which provides details of the conditions of the user's home while he or she is away, yet enjoying the IOT application anytime and anywhere.Rugged mobile devicesBesides the wearable device and smart household appliance, GoldTek continues implementing the technology of its ARM-based Rugged PDA and tablets, which are also being showcased at the exhibition.GoldTek is at Computex 2014, World Trade Center Nangang Exhibition, 4th floor, booth M1320.

Gigastone is a provider of wireless networking and mobile phone periphery products. During Computex 2014, Gigastone is showcasing a series of multi-functional smartphone and tablet companion products that will satisfy the needs of the majority of mobile product markets.During the exhibition, the focus of Gigastone is on the patented "Smart Box A4." It supports Wi-Fi streaming function for smartphones or tablets to playback or transfer data from USB drives or memory cards attached to Smart Box A4. It also has a wireless router function to convert Ethernet networks to Wi-Fi networks, enabling Internet sharing for more devices including smartphones, tablets and PCs. Another function of Smart Box A4 is its mobile power bank, using 5200mAh Samsung lithium batteries.The Smart Box A4 has won the Best Choice Award of Computex 2014 sponsored by the Taiwan External Trade Development Council and Taipei Computer Association. This year, the judging criteria are "functionality," "innovation," and "market potential." A total of 477 products were evaluated in the competition and Smart Box A4 was finally awarded for its novel, rich, convenient functions, according to Gigastone.Smart Box A4 integrates the functions of wireless router, wireless streaming, wireless storage and portable power bank. The 4-in-1 capability makes it a convenient companion for people who use mobile devices daily. At the size of a palm and weighing 140 grams, Smart Box A4 is handy and portable. For streaming use, up to six devices can be connected via Wi-Fi and each device can browse different files. During streaming, devices can still connect to the Internet through Smart Box A4 since Internet Bridge is supported.Other new products introduced by Gigastone include OTG USB flash drive, Metal-Slim USB flash drive and new models of stylish power banks. The new OTG USB flash drive has both USB and Micro USB connectors to connect to PC or Android mobile devices. This new feature enables users to easily and quickly exchange data between their PC and Android mobile devices.Gigastone's Smart Box A4 all-in-one mobile companionPhoto: CompanyAbout GigastoneGigastone Corporation is a provider of novel wireless networking and mobile phone periphery products. The company holds patents in a variety of mobile and networking categories, and also NAND flash controller IC technologies. Gigastone is listed in the emerging stock market section of the Taiwan Stock Exchange and has 11 sales/marketing branches in Asia, America and Europe. Major products of Gigastone cover wireless networking, mobile phone periphery, flash memory card, USB flash drive, and flash controller IC. Gigastone is continuously devoted to expanding global business and investing in research and development of new products and technologies.For more information please visit: www.gigastone.com

Etasis provides high-end redundant power supplies for such server, storage, automation control, cloud, and even network power applications. In recent years, development in "cloud computing" has given birth to a "cloud" industry, which has profound effects on the computer industry and its supply chain.As a key player in the power supply sector, Etasis has been focusing on developing cloud-based power supplies since the early stage of the cloud industry. Cloud computing integrates and optimizes higher density computing devices, which helps bring more computing power than traditional datacenters. The size of cloud-based power supplies is usually reduced, and their power output increased to allow more power and space for computing units. With such high power density, power efficiency is crucial in assisting heat dissipation and reducing utility cost. More importantly, centralized power monitoring and management is necessary to manage massive arrays of power and computing systems. Power Management Bus (PMBus) has become a standard communication protocol for communication between the system and power supply. Through PMBus, system administrators can interact with power supplies to keep peak efficiency and lower power loss with preset power policies and real-time monitor and control. In summary, smaller, more powerful, more efficient and intelligent power supplies are the trend of the power industry.Etasis has been designing digital power units since 2008. During these years it has developed internal digital control technologies using on-board software to closely monitor and control the loop from power input to output. Not only can Etasis shrink the size of power supply components and achieve higher efficiency and lower cost, but it can also make power supplies more intelligent. Through the PMBus interface, customers can monitor and control Etasis' redundant power supplies and further optimize system power consumption.Etasis has been manufacturing redundant power supplies for mission-critical applications for more than 18 years. Etasis' redundant power supplies can be adapted to communicate with any system via firmware and PMBus customizations. This digital capability is Etasis' key strength. The redundancy aspect of designs alone is not enough; the digital aspect of design is the key to staying competitive in the market.Etasis' roadmap is defined based on application trends. Making smaller but more efficient devices is the company's goal. In 2014 Etasis is surfing on the "cloud," targeting network and server power supplies based on its mature digital designs, looking to provide more cost-effective power solutions. Please visit Etasis' booth at Computex at TICC, 202B.Etasis NEBS-compliant Cloud PowerPhoto: Company

Edge-Core Networks Corporation, a professional provider of solutions that keep information moving and connections strong for businesses, from SMB and enterprise to service providers and carriers, will showcase its complete 10G/40G switch solutions for data center with variety choices of software, at Computex Taipei at booth A0904, Hall 1, TWTC.At Computex, Edge-Core Networks showcases its extensive offerings of high-port density 40G/10G Top-of-Rack (TOR) and Spine switches dedicated to data center applications, under its Edge-Core brand, including:- AS6700-32X 40G data center switch with 20 x QSFP 40GbE switch or 4x10GbE and two optional slots for 6 x QSFP module- AS5600-52X 10G data center switch with 48 x SFP+ 10G port plus 4 x 40 QSFP+ - AS5710-54X 10G TOR switch with 48 x 10G SFP+ and 6 x 40GbE QSFP- AS4600-54T GbE TOR Switch with 48 x RJ45 GE plus 4 x SFP for 10GE or 1GE uplinkAs a member of ONIE.org, the entire portfolio of Edgecore bare-metal switches ship with Open Network Install Environment (ONIE), enabling the automated installation of independent switchOS software from partners, including Cumulus Networks, Broadcom, and Big Switches. With a variety of software options under the same hardware, Edgecore Networks helps to enrich and extend the product line and channel coverage to serve those new data center build outs with TOR and/or Spine network projects and for those customers who have in-house Linux expertise and open source software and the traditional networking management models. Together with Edgecore's worldwide partner, the data center switches have been field-proven deployed in different services for finance or social network applications.Together with data center switch series, the following Edge-Core Networks solutions, SMC Networks, and Metalligence (also a subsidiary of Accton Technology) will also be displayed.- ECS5610/ECS4600/ECS4110 series: 10G/GE infrastructure switch series from core networks to distribution, to access networks with EdgeCOS- ECWO5320/ECW5320 series: Outdoor and indoor wireless 11ac access points with optional cloud-based easy-to-deploy platform- SMCGS Switch series: Websmart and push-to-smart switches designed for SMB and MSO specific markets- Telco and MSO broadband CPE solutions for home users, with OTT/STB entertainment applications- Home security and energy control system designed for home and business applicationAccton group products are on display at booth A0904 Hall 1, Taipei World Trade Center.Edge-Core Networks' 10G/40G data center switch seriesPhoto: CompanyAbout Edge-Core Networks CorporationHeadquartered in Hsinchu, Taiwan, Edge-Core Networks Corporation was originally established as part of the Accton Technology Group responsible for global branded business. In 2010, Edge-Core Networks was spun-off into an independent subsidiary. Edge-Core Networks provides solutions that keep information moving and connections strong for businesses from the SMB and enterprise, to service providers and carriers.Additional information can be found at the Edge-Core Networks website, (www.edge-core.com) or (www.smc.com).Press ContactEdge-Core Networks Corp.Wendy WangMarketing CommunicationsEmail: wendy_wang@edge-core.com

ASRock, a leading motherboard manufacturer, unveils the brand new Intel 9 series motherboards with ASRock Super Alloy technology! Packing the Intel Z97/H97 chipsets, ASRock 9 series Super Alloy motherboards provide great compatibility and fully support the 5th, new 4th and 4th generation Intel core processors in socket 1150. The product lines include the Extreme series for high-end PC, the Fatal1ty Killer Gaming series for elite gamers, and the OC Formula series for OC enthusiasts.Derived from the "built for stable and reliable" designing concept, the 9 series motherboard are specially designed with ASRock Super Alloy technology, including 12K platinum capacitors with the longest lifespan in the industry, the next-gen NexFET MOSFET, dual-stack MOSFETs (DSM), premium alloy chokes, and XXL aluminum alloy heatsinks, according to the vendor.The flagship model ASRock Z97 Extreme6 with "Ultra M.2 PCIe Gen3 x4" socket stands out among all 9 series motherboards. With its doubled transfer bandwidth, ASRock Ultra M.2 is able to break through the speed limit of SATA3 6Gb/s. In addition, Z97 Extreme6 also packs ASRock Super Alloy technology, 12 phase power design, Purity Sound 2, dual LAN, SATA Express interface, ASRock Cloud and other features.With these onboard components, all three product lines of ASRock 9 series Super Alloy motherboards offer stability and reliability, the vendor said.ASRock 9 series motherboards and the Super Alloy technology are showcased at the ASRock booth at L1018, 4F, Nangang Hall during Computex Taipei 2014.ASRock's new IntelR 9 series motherboards with ASRock Super Alloy technologyPhoto: Company

Congatec AG, a leading manufacturer of embedded computer modules, extends its board-level product range with the first industrial Mini-ITX motherboard. The new embedded motherboards will meet the same standards and quality as the established computer-on-modules from Congatec. Additional services include 7+ years availability, global technical support, extended manuals, specifications and customized design services.The Conga-IGX Mini ITX board is based on AMD Embedded G-Series SOC technology and integrates the next-generation computing power of the "Jaguar" based processor and high performance AMD Radeon graphics cores in a compact package.Users benefit from outstanding multimedia performance, an excellent performance-per-watt ratio and flexible task allocation on the CPU and GPU. Thanks to these features, the new Conga-IGX board is an ideal solution for cost-sensitive visualization and control applications."Embedded Mini-ITX is a great addition to our computer-on-module family and extends our embedded computer scalability with a great entrance product on the board level. Additional Mini-ITX boards will soon follow," said Martin Danzer, director, Product Management, Congatec AG.The right processor technologyCongatec offers three new Mini ITX motherboards on the AMD Embedded G-Series SOC platform. A low-energy 9W TDP 1.0 GHz dual-core processor GX-210HA SOC with integrated AMD Radeon HD 8210E graphics; a dual-core 18W TDP GX-217GA SOC processor model with integrated AMD Radeon HD 8280E graphics; and a 2.0 GHz quad-core AMD embedded GX-420CA SOC with integrated AMD Radeon HD 8400E graphics.The AMD embedded G-Series SoC platform integrates all the aforementioned demands in a single system-on-chip design. AMD is leading in the development of a heterogeneous system architecture (HSA) which is also fundamental for IoT applications. Furthermore, AMD has developed the embedded G-Series SoCs specifically for power-, graphic-, and cost-sensitive SFF designs. They are available as dual- and quad-core versions and are based on the "Jaguar" CPU core with 28nm manufacturing technology and 8000-series AMD Radeon graphics. They can process more instructions per clock cycle, which is also reflected in the execution of various compute-intensive industry standard benchmarks: Compared to the Intel Atom, the AMD G-Series SoCs achieve a 125% improvement in CPU performance when performing industry-standard compute-intensive benchmarks, according to the vendor. The ability of the SoC platform to support enterprise-class error-correction code memory (ECC) makes it the perfect choice for applications requiring high levels of data integrity without compromising energy efficiency.The discrete-class graphics, which are integrated into the AMD Embedded G-Series SoC, enable power applications that previously required a separate graphics processor. AMD G-Series SoCs provide up to 20% more performance when compared to the previous generation AMD G-Series processors and a five-fold improvement over the Intel Atom D525 processor. DirectX 11 and OpenGL are supported on up to two independent displays. Thanks to an improved Universal Video Decoder, new opportunities have opened up for hardware-based video encoding. Furthermore, with the open computing language, OpenCL, computing-intensive tasks can be reassigned to the graphics processor with high parallelism. For such applications, the integrated GPU provides a computing performance of up to 256 GFLOPs. This allows AMD Embedded G-Series SoCs to be used in deeply embedded or "headless" IoT appliances, which are used in environments without a screen, monitor or input device and which do not require a graphics solution.The Conga-IGX featuresThe integrated AMD Radeon graphics feature the Universal Video Decoder 4.2 for seamless processing of BluRays with HDCP (1080p), MPEG-2, HD and DivX (MPEG-4) videos. The conga-IGX also supports DirectX 11.1 and OpenGL 4.0 for fast 2D and 3D imaging and OpenCL 1.1. Interface options include single/dual channel 18/24bit LVDS, DisplayPort 1.2 and DVI/HDMI 1.4a and enable the direct control of two independent displays. DisplayPort 1.2 also enables ATI Eyefinity multi-display technology for panorama view and multi-streaming, making it possible to control up to two displays per graphics port in daisy chain mode.The low power draw of the new SOCs also makes fanless designs possible. This not only makes the systems quieter, but also more reliable since unreliable mechanical components such as fans can be eliminated. Sophisticated power management has a positive impact whenever there are wait times in an application. CPU state C6 "deep power down" is available on the multimedia engine as well, making it possible to further reduce power consumption without impairing ease of use since the computer needs less than a millisecond in order to switch from energy saving mode to full computing power.1x PCIe x4 connector and Mini-PCI Express onboard, Dual GbE LAN onboard, 2x Serial ATA III, 1x mSATA (SATA III) socket support, 7x USB 2.0 and 2x USB3.0 onboard, 8 Bit GPIO onboard, 3x serial port and 1x parallel port onboard allow flexible system expansion at high data bandwidth. DC power supply 12V/19-24V, ACPI 3.0 power management and high-definition audio complete the package.Ready for IoTThe fastest way for OEMs to integrate the AMD G-Series SoC into their IoT (Internet of Things) designs is by using Congatec's Mini-ITX motherboards. They can be obtained off-the-shelf and are ready-to-use, plus, they boast a broad ecosystem of building blocks such as peripherals, chassis and cooling solutions. This makes system development a comfortable, fast and easy task. However, not just any motherboard is suitable for IoT appliances. OEMs should check for high quality boards with long-term availability. An intelligent board design with high EMC (electromagnetic compatibility), long-lasting components, such as poscaps and an extended temperature range, is essential, if OEMs want reliable IoT appliances. With the premiere of its first industrial motherboard, Congatec has now also transferred its expertise and quality standards of computer-on-modules into the SBC (single board computer) market. OEMs will benefit from the company's high German engineering quality together with an additional services range of 7+ years availability. Further examples of the added value provided are the global technical support, extended specifications and customized design services.Congatec's first Mini-ITX with AMD embedded G-Series SOC, integrated Radeon graphics on board, and 7+ years availability.Photo: Company

During 2013, award-winning composer Hans Zimmer first used the new DTS Headphone:X surround sound technology to produce the "Man of Steel" motion picture soundtrack. This advanced technology, developed by the audio experts at DTS, allows mobile devices to accurately reproduce the acoustics of a studio soundstage through an ordinary pair of headphones.Not long ago, it was believed that to enjoy a premium surround sound experience, one would have to own high-end home theater equipment. But, DTS, a leader in high-definition audio solutions and audio enhancement technologies, has shaken up this common perception with its Headphone:X technology, which is capable of recreating up to an 11.1 channel home theater surround sound environment on mobile devices.Aaron Chen, GM, Business Development Taiwan, APAC said, "Although people are used to listening to music and watching videos over mobile networks, two-channel stereo headphones that normally come with mobile devices simply cannot offer the same kind of listening experience as found in a high-quality audio production studio. But, thanks to the advanced technology behind Headphone:X, listeners are now free from their hardware's limitations and able to turn their mobile devices into powerful pocket-sized home theaters."Headphone:X: Home Theater in Your PocketIn early 2014, DTS introduced the Headphone:X Tuning Program that offers headphone makers access to tools and support designed to optimize their products to deliver an excellent Headphone:X experience. Leading headphone manufacturers, including Panasonic, Skullcandy and Turtle Beach, have joined the program. Meanwhile, DTS has been working with mobile brands to build the Headphone:X interface, a control center for the technology that contains options for consumers to select their specific headphones from a list, personalize the overall experience to their taste and save the settings as a unique profile, into their mobile products.It is also worth noting that the Hi-Fi smartphone XPlay 3S debuted by Chinese manufacturer Vivo, is fitted with Headphone:X, offering users access to not only the Headphone:X app, but to content mixed for the technology - allowing them to enjoy immersive mobile content with DTS surround sound anywhere, anytime.Headphone:X continues to expand its footprint beyond hardware to content owners. After the successful launch of the "Man of Steel" app on Hans Zimmer's Z+ platform, many other original motion picture soundtracks and music albums have been produced in the format.Play-Fi Certified ODM Program Garners Wide SupportThe other state-of-the-art audio solution from DTS is Play-Fi, a wireless audio streaming technology that connects all the music on your mobile devices to one or more speakers in the home for friends and families to share, all over a standard WiFi connection.According to Chen, "Play-Fi is an advanced open audio platform capable of streaming lossless, high-quality audio from Android, iOS and Windows devices to multiple rooms from multiple users simultaneously using a standard WiFi network. Consumers only need to download and launch the free Play-Fi app, which automatically finds and connects speakers to the WiFi network via any standard wireless router (no need for a costly exclusive receiver), with only five to 10 minutes taken to get the system set up."To expand the Play-Fi ecosystem, DTS announced earlier this year a Play-Fi Certified ODM Program. The program currently includes several leading audio manufacturers, including: Lite-On Technology, Meiloon Industrial, AmTRAN Technology, Wistron, Zylux Acoustic, Eastech Electronics, Fenda Technology, Hansong Technology and Tymphany. Leading audio brands, such as Polk and Definitive Technology will also soon be rolling out their own Play-Fi speaker solutions, and the technology continues to expand to include personal devices such as mobile phones and laptops.At Computex Taipei 2014, Asustek will showcase new products to feature Play-Fi, while G-Star will unveil headphones with Headphone:X processing built-in. Additionally, Acer is expected to debut four new smartphones incorporating DTS audio enhancement technology. At this year's Computex, visitors can get a glimpse of DTS' advanced audio technologies, not only at the DTS booth, but at several of its partners' booths as well.The V5 Wi-Fi speaker of Wren Sound Systems that supports the Play-Fi standardPhoto: Company

According to a Gartner report on the HDD enclosure IC market, JMicron has been the top vendor since 2010. As the leading vendor of storage controllers, JMicron will launch various innovative and optimized storage controllers at Computex 2014.JMicron is going to launch storage controllers based on the latest USB3.1 10Gbps technology, and will give live demonstrations in a private suite at Grand Hyatt Hotel, Taipei. In addition, there will be the dual-port SATA RAID/CLONE JMS561/562/561U SATAIII storage controllers, with solid reliability and compatibility with hardware RAID engines. JMicron will launch various applications fulfilling the requirements of port multipliers supporting JBOD, RAID0/1 and CLONE.There will also be optimized controllers supporting single/multiple-port SATA III storage solutions. The JMicron JMS567/577/575 series enable less power consumption, better performance, cost efficiency, and more connectivity with SSD, SSHD, Blue Ray optical drives, SMART TVs, and STB.As for SSD (solid state drive) controllers, JMicron will demo new SATA3 SSD controllers, JMF670/JM670H, which support Micron L95B NAND flash and SSD capacity up to 512GB. JMicron will also showcase PCIe SSD controller solutions: JMF810, which is a PCIe Gen 2 x 2 Lane and SATA3 combo SSD controller; JMF811, which is a PCIe Gen 2 x 4 Lane SSD controller. These two PCIe SSD controllers feature sequential read/write performance of over 1500MB/s. Furthermore, these two controllers implement JMicron new Data Management Engine to improve performance and total byte write to the NAND.JMicron Technology Corporation is a fabless IC company dedicated to producing innovative solutions and offering the most competitive solutions to the market. It shipped over four million SSD controllers in 2013. In 2014, JMicron will continue to provide most competitive SATA3 and PCIe interface SSD controllers to the market.USB 3.1 FPGA platform with new 10Gbps USB3.1 technologyPhoto: CompanyJMS577 USB3.0 to SATA III enhanced controllerPhoto: Company

AORUS, an emerging force of gaming hardware, has launched the lightest - 1.87kg - and most powerful 13-inch gaming laptop in the world - X3. Delivering excellence and pushing performance to the extreme, AORUS has yet again pushed the envelope by fitting a GTX870M 6GB GDDR5 VRAM in a slim chassis (22.9mm) at the same time ensuring optimum mobility.Available in a stunning 3200x1800 resolution, the QHD+ panel delivers unmatched color and image quality. The X3 has two display options: the X3 with a 13-inch display and the X3 Plus that has a 13.9-inch display. Maximum mobility with maximum performance: the X3 from AORUS is perfected to deliver the most mobile experience - gaming on the go, without compromising on performance.Lean, Mean, Machine: Less than an inch, 1.89kg (4.16lbs), GeForce GTX870M 6GB GDDR5True to its mantra of "Exceed with Less," the X3 weighs in at 1.87kg, while less than an inch in height with a footprint of only 330cm, making it by far the lightest and most mobile gaming laptop known today. Perfect for those who love to travel light, the X3 is the only machine capable of delivering a powerful performance in such a small form factor. With 1080p gaming at ultra-detail settings from Nvidia GeForce GTX870M 6GB GDDR5 VRAM scoring an impressive P7104 in 3D Mark 11, the X3 will play all your games the way they were meant to be played. Experience all the GeForce GTX gaming experience in the most portable package available today.3K Display for Ultra Accuracy & Stunning DetailsX3 comes standard with a 13-inch 2560x1440 resolution display while the X3 Plus has options of 13.9-inch QHD 2560x1440 or QHD+ 3200 x 1800 resolution display. The anti-glare QHD+ display offers unprecedented sharpness for a revolutionary gaming experience. A feature formerly exclusive to hi-end TV and PC monitors, QHD+ is now an X3 Plus standard. The ultra-high 3200x1800 resolution offers breathtaking details rarely available on such mobile devices. 72% NTSC color gamut produces crystal clear images with stunning color accuracy. The extraordinary high luminance, 400 cd/m2, produces unmatched clarity and readability even outdoors or in brightly lit rooms.Streamline Design, Superb Cooling, Next Generation StorageCarrying the signature theme of the stunning AORUS chassis, a style that blends futuristic concepts of minimalism and fluidic sculpture, the metallic silver falcon rests on the center with sculpted lines and three molded ridges surrounding the full aluminum matte black chassis. The chassis beautifully incorporates dual vents, dual thermal pipes and dual fans achieving excellent stability even after hours of demanding operation. A pair of 512GB Next Generation Form Factor (NGFF) m.2 SATA solid state drives in lightning RAID 0 push performance to the forefront. Two memory slots allow maximum capacity at 16GB DDR3L 1600hz SDRAM eliminating all obstacles between gamers and the most engaging gaming experience.Macro Engine and Cinematic Gameplay at 4KCustomizable Macro Engine is exclusive to AORUS and is available on the X3. Macro keys rarely available on gaming laptops are now an AORUS gaming laptop standard. Simplify and record your killer combos into one-click execution keys. The scissor-switch key structure guarantees lightning response and great tactile feedback ensuring pure dominance during gameplay. Hardcore gamers who demand minimal distraction will find the backlit keyboard with adjustable lighting a handy supply during intense gaming in dimly lit rooms.Enjoy gaming on an external 4K display at 60Hz. Experience engaging gaming moments on the largest and best display with incredible detail. This is possible through a mini-display port standard on the X3.Relentless Innovation; Endless EvolutionPacked with the renowned Killer LAN chip and Intel 802.11ac, the X3 guarantees gamers unprecedented online gaming experiences for either on-site or on the move. Killer LAN chip optimizes network connection quality while allowing users to prioritize gaming sessions for seamless online gaming without latency. Intel 802.11ac solution brings extended coverage and stronger throughput, which greatly improves signal stability for gaming wireless by Wi-Fi. Signals to be transmitted achieve excellent packet transmission even under busy network traffic while generic LAN chips manage an average of 14.9% packet loss rate.Contact: Hanif@aorus.comAORUS X3Photo: Company

Gigabyte Technology, a leading IT products manufacturer, will showcase this week its newest product lineup of server and embedded solutions at Computex 2014.At the core of this updated lineup, Gigabyte will present its server motherboards supporting the brand new processors from the Intel Xeon processors E3-1200 v3 product family. These Intel C220 chipset-based motherboards will deliver higher computing performance and lower power consumption to answer today's ever increasing computing standards, according to the vendor. In addition, Gigabyte will reveal its SoC solutions for the embedded industry, including two innovative Intel Atom motherboards (formerly Avoton and Bay Trail) and the GA-FSD0C1, a Freescale platform."We are very excited about the upcoming Computex where we have the chance to introduce our products to users and interact with them personally," commented Etay Lee, general manager of Gigabyte. "Users can obtain detailed product information, understand applications for business and home environments, and acquire good product experience from Gigabyte at Computex." Etay added.Gigabyte cordially invites you to visit us at Computex 2014, booth D0002 in TWTC Hall 1. To learn more about Gigabyte's server and embedded products, please visit: b2b.gigabyte.com