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Winbond, Toshiba, and Fujitsu jointly develop 0.1-micron DRAM process

Amber Chiu, Taipei; Liu Yi-fang, DIGITIMES Asia 0

After announcing its cooperation with Japan’s Toshiba and Fujitsu to develop advanced DRAM process technologies in May, Winbond recently has successfully developed 0.1-micron-and-below capacitor technology intended for DRAM production.

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