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ASE kicks off volume production of 12-inch bumping

Pei-chun Tang, Taipei; Jane Wang, DIGITIMES Asia Wednesday 30 October 2002 0

Advanced Semiconductor Engineering (ASE) on October 29 announced that its 12-inch wafer solder bumping line is ready for volume production. The technology will be used to package high-frequency communications chips, high-end graphics chips and proces...

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