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Nan Ya targets high-end IC substrate sales and expects double-digit growth in 2025

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Taiwan braces for Trump 2.0

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AI robot market outlook promising; Foxconn prioritizes capacity efficiency

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Rumors circulate regarding Foxconn exploring investment in Nissan

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Trade between China and Taiwan continues to rise

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Speculation arises about CXMT kicking off DDR5 volume production

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MediaTek intros new SoC for light flagship handsets

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Huahong names new chair

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Home Tech Semiconductors

ASE kicks off volume production of 12-inch bumping

Pei-chun Tang, Taipei; Jane Wang, DIGITIMES Asia Wednesday 30 October 2002 0

Advanced Semiconductor Engineering (ASE) on October 29 announced that its 12-inch wafer solder bumping line is ready for volume production. The technology will be used to package high-frequency communications chips, high-end graphics chips and proces...

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