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UMC to see surging 12-inch wafer output at 0.13-micron node during 4Q

Samson Yu, Taipei; Jack Lu, DIGITIMES Asia Monday 29 September 2003 0

United Microelectronics Corporation (UMC) projects strong 12-inch wafer output using 0.13-micron processing in the fourth quarter, thanks to a major client’s aggressive migration to the advanced process, said sources.

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