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ASE, SPIL raise BGA prices by 10%

Cage Chao, Hsinchu; Jack Lu, DIGITIMES Asia Tuesday 21 October 2003 0

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries Ltd (SPIL) have raised prices for BGA (ball-grid array) packaging by about 10% this month due to the combined effect of tight capacity and rising material cost, said source...

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