ChipPAC, a US-based packaging and testing house, on November 11 announced delivery of its six stacked-die CSP (chip-scale package) solution in 1.6mm profile, according to a company press release.
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ChipPAC, a US-based packaging and testing house, on November 11 announced delivery of its six stacked-die CSP (chip-scale package) solution in 1.6mm profile, according to a company press release.