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ASE to boost flip-chip capacity by 500% in 2004

Amy Lee, Kaohsiung; Jack Lu, DIGITIMES Asia Monday 22 December 2003 0

Expecting sliding flip-chip (FC) packaging costs will boost demand in the next two years, Advanced Semiconductor Engineering (ASE) plans to boost its monthly FC capacity fivefold in 2004, from between three million and five million units currently,...

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