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Order of Nvidia GB200 supply alters; 2nd-tier ODMs to benefit

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Korean chipmakers consider reducing LPDDR4 memory output

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Given Rapidus' bleak outlook, can TSMC restore Japan's industry?

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Ultra-large TVs drive overall TV sales value during Double 11

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Brands pursue supply chain relocation as globalization fades

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AUO steadily expands its smart mobility offerings

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Is the potential for robotics startups surging? Industry development takes time

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MCU firm Padauk pursues cost structure optimization

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Microsoft CVP considers Taiwan's supply chain important as data center demand develops

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New US ban on China on its way; Taiwan IC design houses may gain

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Molicel enters supply chain for AI BBU

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Home Tech Semiconductors

ASE to deliver seven stacked-die MCM in 2004

Amy Lee, Taipei; Jack Lu, DIGITIMES Asia Tuesday 23 December 2003 0

Advanced Semiconductor Engineering (ASE) has successfully developed seven stacked-die multi-chip modules (MCMs) within one millimeter vertical height, and volume production is set to begin sometime next year, according to JJ Lee, R&D president at...

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Crypto market capitalization tops US$3.2 billion on Trump's victory

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