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Home Tech Semiconductors

ASE to deliver seven stacked-die MCM in 2004

Amy Lee, Taipei; Jack Lu, DIGITIMES Asia Tuesday 23 December 2003 0

Advanced Semiconductor Engineering (ASE) has successfully developed seven stacked-die multi-chip modules (MCMs) within one millimeter vertical height, and volume production is set to begin sometime next year, according to JJ Lee, R&D president at...

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