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TSMC to triple its China fab capacity in 2005

LR Huang, Shanghai; Jack Lu, DIGITIMES Asia Friday 29 October 2004 0

Taiwan Semiconductor Manufacturing Company (TSMC) is beginning to pilot-produce chips at its China-based Fab 10 and plans to triple the fab’s capacity to 35,000 8-inch-equivalent wafers in 2005, according to FC Tseng, deputy CEO of TSMC.

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