Amkor and STATS ChipPAC to expand packaging lines in China

Amy Lee, Hsinchu; Jessie Shen, DIGITIMES Asia Thursday 28 July 2005 0

Leading IC packaging and testing firm Amkor Technology and STATS ChipPAC are eying the China market and plan to expand their respective testing and assembly lines in China, with expansion targeted for CSP (chip scale packaging), ball-grid array (BGA),...

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