Research Report Database

REALTIME NEWS

China carmakers explore subscription and modular models as answer to car graveyards

Tomorrow's Headlines

Qualcomm shifts toward data center chips as AI demand squeezes memory supply

Tomorrow's Headlines

Samsung DRAM profit lead exposes a new HBM battleground

Tomorrow's Headlines

Chinese one-time car model draws in Taiwanese electronics and chip suppliers

Tomorrow's Headlines

Samsung 4nm yield reportedly tops 80% as foundry and memory recovery gains steam

Tomorrow's Headlines

Win Semiconductors says GaAs and InP supply remains sufficient

Tomorrow's Headlines

Home Tech Semiconductors

ASE aims to boost PBGA capacity to 60 million chips this year

Amy Lee, Taipei

Feb 8, 2006, 20:59 0

Advanced Semiconductor Engineering (ASE) reiterated that its fire-damaged plastic ball-grid array (PBGA) substrate capacity has been fully restored since December 2005 and the company plans to boost its monthly capacity to 60 million units in 2006, up from 33...

The article requires paid subscription. Subscribe Now

LOGIN

Email address

Password

Keep me signed in

Keep me signed in

Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site. To activate this function, check the 'Keep me signed in' box in the log-in section. This will save the password on the computer you're using to access the site.

Note: If you choose to use the log-out feature, you will lose your saved information. This means you will be required to log-in the next time you visit our site.

Enterprise first-time login?

Forgot your password?

Create your free account

Select premium stories & daily editor picks.
Leverage AI summaries for instant insights.
Receive tech briefings & newsletters.
Track financials & stock data of Taiwan tech.

No credit card required

Research Report Database

iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory

marketing

MOST-READ
7 DAYS NEWS