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ASE aims to boost PBGA capacity to 60 million chips this year

Amy Lee, Taipei; Esther Lam, DIGITIMES Asia Wednesday 8 February 2006 0

Advanced Semiconductor Engineering (ASE) reiterated that its fire-damaged plastic ball-grid array (PBGA) substrate capacity has been fully restored since December 2005 and the company plans to boost its monthly capacity to 60 million units in 2006,...

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DotDot Global joins forces with AWS JIC to target global markets with food service technology

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