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Hsinchu to house five more 12-inch wafer fabs

Claire Sung, Taipei; Carrie Yu, DIGITIMES Asia Thursday 4 January 2007 0

Hsinchu Science Park (HSP) will finish acquiring land for its third-phase development plan after Chinese New Year and the area will be able to accommodate five more 12-inch wafer fabs in the future, according to Der-Ray Huang, director of HSP.

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