ASE and NXP to partner on IC testing and packaging in Suzhou

Press release, February 2; Esther Lam, DIGITIMES Asia Friday 2 February 2007 0

Advanced Semiconductor Engineering (ASE) and NXP Semiconductors, formerly Philips Semiconductors today announced the signing of a memorandum of understanding to form a joint venture (JV) in Suzhou, China, to focus on semiconductor testing and packaging...

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