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FC-CSP substrate supply to be tight in 2H07, says paper

Commercial Times, April 9; Esther Lam, DIGITIMES Asia Monday 9 April 2007 0

A Chinese-language Commercial Times report cited industry sources in the packaging and testing industry as saying that there likely may be a supply shortage of flip chip chip-scale package (FC-CSP) substrates in the second half of 2007 as major...

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