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Home Tech Semiconductors

Intermolecular: R&D tools key to rein in costs

Claire Sung, Taipei; Esther Lam, DIGITIMES Asia Tuesday 31 July 2007 0

When IC fabrication process shrinks to sub-65nm geometry, performance enhancement mainly sterns from materials rather than just size scaling. This implies that leading foundries and IC design houses that adopt suitable R&D tool/platforms could save...

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