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Home Tech Semiconductors

TCP quickly loses ground to COF in driver IC packaging segment

Ingrid Lee, Taipei; Rodney Chan, DIGITIMES Asia Tuesday 21 August 2007 0

Tape-carrier packaging (TCP) is coming under heavy price pressure in the third quarter as it is being quickly replaced by chip-on-film (COF) packaging as the mainstream technology for driver IC packaging amid growing demand for smaller and slimmer consumer...

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