Intel, Samsung and TSMC reach agreement for 450mm wafer manufacturing transition

Press release, May 6; Esther Lam, DIGITIMES Asia Tuesday 6 May 2008 0

Intel, Samsung Electronics and Taiwan Semiconductor Manufacturing Company (TSMC) announced they have reached agreement on the need for industry-wide collaboration to target a transition to larger, 450mm-sized wafers starting in 2012. The transition...

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