SEMICON Taiwan 2008: Electronic materials from BASF to allow smaller IC feature sizes

Press release, September 9; Esther Lam, DIGITIMES Asia Wednesday 10 September 2008 0

BASF is showcasing a range of advanced chemical solutions for the semiconductor industry at the ongoing SEMICON Taiwan 2008 (September 9-11), with solutions for 3D through-silicon via (TSV) being highlighted.

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