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Image sensor packaging house XinTec to ship 300,000 WL-CSP wafers in 2008

Claire Sung, Taipei; Steve Shen, DIGITIMES Asia Monday 13 October 2008 0

Image sensor and MEMS-chip packaging house XinTec is expected to ship 300,000 wafer-level chip-scale packaging (WL-CSP) wafers in 2008, with shipments to gain more momentum in 2009, according to estimates by market sources.

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