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SiP getting popular in Wi-Fi chip packaging, says paper

Commercial Times, January 12; Meiling Chen, DIGITIMES Asia Monday 12 January 2009 0

Atheros Communications, Ralink Technology, Broadcom and Marvell are forging closer relationships with Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) in order to secure system in package (SiP) capacity needed this...

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