Research_Server_HPC

REALTIME NEWS

Exclusive: China 6-inch SiC substrate supply tightens, suppliers brace for another price hike

Tomorrow's Headlines

Intel’s EMIB-T emerges as a backup option as CoWoS capacity tightens

Tomorrow's Headlines

AUO unit plans to ride synergy gains momentum into entering TSMC ecosystem

Tomorrow's Headlines

AI buildout lifts demand for China high-speed optical module makers

Tomorrow's Headlines

SJSemi expands 2.5D packaging to 3.3-reticle size for AI and HPC chips

Tomorrow's Headlines

Home Tech Semiconductors

Kinsus BT-based FC and FC CSP substrate shipments to increase in 2009

Ingrid Lee, Taipei

Feb 20, 2009, 14:18 0

Kinsus Interconnect Technology has reported January sales of NT$433 million (US$12.45 million), down 21% on month...

The article requires paid subscription. Subscribe Now

LOGIN

Email address

Password

Keep me signed in

Keep me signed in

Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site. To activate this function, check the 'Keep me signed in' box in the log-in section. This will save the password on the computer you're using to access the site.

Note: If you choose to use the log-out feature, you will lose your saved information. This means you will be required to log-in the next time you visit our site.

Enterprise first-time login?

Forgot your password?

Create your free account

Select premium stories & daily editor picks.
Leverage AI summaries for instant insights.
Receive tech briefings & newsletters.
Track financials & stock data of Taiwan tech.

No credit card required

GlobalExhibition

World Diamond Technology accelerates mass production of 300 mm diamond wafers

reportAIglasses

MOST-READ
7 DAYS NEWS