As advanced packaging technologies and large-size integrated substrate solutions become key development areas for technology firms, glass substrate technology has emerged as a focal...
LG Innotek's equipment investments have significantly decreased in 2024, following two years of substantial investments to meet Apple's needs. The company has now achieved sufficient...
Niching Industrial, a Taiwan-based semiconductor materials and components distributor, has experienced a significant resurgence in orders for its three primary product lines –...
Shin-Etsu Chemical has announced the successful development of a 12-inch quasi-sapphire template (QST) epitaxial substrate, further expanding its range of solutions for gallium nitride...
Increasing silicon carbide (SiC) substrate supply from China at lower prices is expected to fuel Taiwan-based foundry houses' diversification into compound semiconductors.
China-based display solutions supplier BOE Technology has unveiled a roadmap for diversification into making glass substrates for semiconductor packaging.
Provider of semiconductor materials such as silicon wafers, Shin-Etsu Chemical has many semiconductor material products ranked first or second in the market, but it is still concerned...
The second-quarter financial reports of tech giants have been gradually released, with Nvidia delivering results that exceeded expectations, maintaining year-over-year growth, quarter-over-quarter...
Mitsubishi Materials has announced the development of the world's largest rectangular silicon substrate, a technology gaining attention due to advancements in advanced packaging....
Glass Core Substrate (GCS) is becoming a trend that major players in the semiconductor supply chain are avidly pursuing. LG Innotek is reportedly contacting material, components,...
Glass substrate prices are expected to rise in the third quarter of 2024, reflecting the depreciation of the Japanese yen, the tight supply-demand balance, and profits made by some...
Driven by emerging applications such as electric vehicles (EV), AI, and high-performance computing (HPC), IC substrates have attracted significant attention in the semiconductor industry...
Gallium nitride (GaN), a third-generation compound semiconductor, has not developed as rapidly as silicon carbide (SiC). Nevertheless, this hasn't deterred new opportunists from joining...
Glass core substrates (GCS) are poised to play a crucial role in next-generation advanced chip packaging. In response, Japanese and South Korean semiconductor supply chain players...
