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Monday 2 December 2024
TSMC evolves CoWoS technology, to challenge 9x reticle sizes in 2027
TSMC announced at the Open Innovation Platform (OIP) Ecosystem Forum in Europe that its CoWoS packaging technology will achieve certification by 2027, introducing a version with 9x...
Tuesday 26 November 2024
Powering breakthroughs in age of artificial intelligence to ensure PCB and substrate manufacturers achieve optimal results with MKS instruments
The rise of artificial intelligence (AI) and the new energy / autonomous vehicle industry presents both challenges and exciting opportunities for the printed circuit board (PCB) and...
Thursday 21 November 2024
U.S. government announces up to $300 million in funding to boost advanced semiconductor packaging
The U.S. government announced plans to invest up to $300 million in three advanced semiconductor packaging research projects located in Georgia, California, and Arizona. These projects...
Tuesday 19 November 2024
UK compound semiconductor provider IQE considers sale of Taiwan subsidary
UK-based epitaxial wafer and substrate provider IQE has reported that the overall market recovery is weaker than anticipated. As a result, the company expects its revenue for 2024...
Tuesday 5 November 2024
SDC advances its 8.6G IT OLED mass production plan to 2025
Samsung Display (SDC) plans to accelerate the production of its 8.6G OLED panels for IT applications, which will first be utilized in Samsung Electronics' notebook products.
Friday 1 November 2024
China SiC industry faces restructuring; Taiwan firms seek differentiation
With SiC production capacity rising in China, prices have fallen dramatically, potentially leading to a restructuring of China's SiC industry and prompting Taiwan-based players to...
Wednesday 23 October 2024
AI penetration will be key to closing the substrate supply-demand gap, says industry
The second half of the year is typically a peak season for substrates. Despite market volatility, strong demand for AI continues to drive the global integrated circuit (IC) substrate...
Tuesday 22 October 2024
Manz pushing CoPoS to drive up AI chip capacity
Thanks to the AI tsunami, demand for AI chips from all sectors is continuing to surge. The Chip-on-Wafer-on-Substrate (CoWoS) architecture that dominates existing 2.5D and 3D packaging...
Tuesday 22 October 2024
Japan's semiconductor firms intensify efforts on GaN expansion amid growing demand for EV and AI
As global semiconductor firms invest in compound semiconductors, Japan-based companies are stepping up their efforts on gallium nitride (GaN) to expand its applications beyond electric...
Tuesday 22 October 2024
SiC prices plunge as Chinese capacity soars, reshaping semiconductor landscape
Silicon carbide (SiC) once thrived amid substrate shortages. However, 2024 saw a significant shift where Chinese manufacturers dramatically ramp up production, resulting in a collapse...
Thursday 17 October 2024
Shin-Etsu Chemical enters semiconductor manufacturing equipment market with interposer-eliminating technology
Shin-Etsu Chemical announced its entry into the semiconductor manufacturing equipment market with new technology designed to eliminate the need for interposers. This innovation could...
Monday 30 September 2024
Global advanced IC substrate market set to surge to US$31.54 billion by 2029
The global advanced IC substrate market is poised for significant growth, according to recent industry reports. Global Information, Inc. (GII) projects the market to reach US$18.11...
Thursday 19 September 2024
Glass substrate technology gains traction for advanced packaging by 2026
As advanced packaging technologies and large-size integrated substrate solutions become key development areas for technology firms, glass substrate technology has emerged as a focal...
Monday 16 September 2024
iPhone 16 reduces investment pressure on LG Innotek with folded zoom
LG Innotek's equipment investments have significantly decreased in 2024, following two years of substantial investments to meet Apple's needs. The company has now achieved sufficient...
Friday 13 September 2024
Niching targets revenue boost from AI server cooling, substrates, and driver ICs
Niching Industrial, a Taiwan-based semiconductor materials and components distributor, has experienced a significant resurgence in orders for its three primary product lines –...
CHT
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research