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    NEWS TAGGED SUBSTRATE
    Tuesday 15 September 2026
    Phoenix Pioneer Technology AI power substrate order visibility extends to 1Q27

    IC substrate manufacturer Phoenix Pioneer Technology (PPt) turned profitable in the first half of 2026, driven by strong momentum in...

    Tuesday 15 September 2026
    Exclusive: China's 8-inch SiC suppliers turn to pricing discipline after 6-inch price war

    As the silicon carbide (SiC) industry shifts from 6-inch to 8-inch wafer manufacturing, leading China-based substrate suppliers are...

    Monday 14 September 2026
    DIGITIMES Insight: Taiwanese firms lead in FOPLP as overseas rivals race to catch up
    Taiwanese chip packaging firms are advancing fan-out panel-level packaging (FOPLP) and glass-substrate development as AI processors demand ever-larger reticle sizes and more complex...
    Saturday 12 September 2026
    Murata targets mass production of its AI power substrate next year
    Murata Manufacturing plans to begin mass production next year of iPaS, the power substrate it has spent several years developing for AI chips, a step that would carry the world's largest...
    Friday 11 September 2026
    Samsung Electro-Mechanics, LG Innotek vie in AI package substrates
    At South Korea's recent KPCA Show 2026, Samsung Electro-Mechanics and LG Innotek showcased their next-generation package substrate technologies. As AI semiconductors evolve toward...
    Thursday 10 September 2026
    Nanoprinting lithography shifts from round to square, increasing waveguide output
    Nanoimprint technology is shifting from round to square substrates. Qingdao GermanLitho noted that this transition has become vital for volume manufacturing as the industry demands...
    Thursday 10 September 2026
    AUO matching glass substrate size stokes TSMC collab speculation
    AUO is accelerating its transformation by extending its established large-format panel manufacturing capabilities into advanced semiconductor packaging.
    Thursday 10 September 2026
    Nvidia reportedly drives testing interface capacity crunch, pushes Taiwan suppliers
    AI chip demand is tightening high-end testing interface capacity, and supply-chain sources say Nvidia has raised prices to secure most of the probe card and test socket output from...
    Wednesday 9 September 2026
    LG Innotek tackles glass substrate microcrack issue as 2028 production race heats up

    LG Innotek is applying internally developed artificial intelligence to semiconductor glass substrate manufacturing, targeting microcracks,...

    Friday 4 September 2026
    Taisic unveils p-type SiC substrate for ultra-high-voltage grid, rail applications
    Taisic Materials, a compound semiconductor company under the Kenmec Group, unveiled a p-type silicon carbide (SiC) substrate on September 2, targeting ultra-high-voltage power applications,...
    Thursday 3 September 2026
    Exclusive: China 6-inch SiC substrate supply tightens, prices set to rise
    China's 6-inch silicon carbide (SiC) substrate market is undergoing a structural supply-demand reversal. Driven by strengthening downstream demand and limited production restarts,...
    Thursday 3 September 2026
    AI substrate shortages widen as Unimicron signals capacity support through 2029
    Unimicron chairman SC Chien said the company is working to ease the tightening shortage of AI substrates as MediaTek seeks capacity support for the next three years, during a public...
    Thursday 3 September 2026
    TRUMPF targets advanced packaging as AI chip makers chase higher density, better cooling
    As AI chips grow more powerful, the race is shifting beyond transistor scaling to packaging, glass substrates, and thermal control. For global readers, that means the next gains in...
    Tuesday 1 September 2026
    Samsung Electro-Mechanics takes glass substrates to Semicon Taiwan
    As AI packages grow larger, the next substrate battleground is rapidly extending from traditional organic materials to glass. Samsung Electro-Mechanics (SEMCO) will make its first...
    Friday 28 August 2026
    Long-term contracts tie up InP capacity due to data center optics demand
    Compound semiconductor supply-chain players say China has recently eased some substrate export controls, but the upgrade of high-frequency transmission in AI data centers toward 200G...
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    BIZ FOCUS
    Oct 23, 08:00
    AI Wealth Management: MaiCoin Leverages Startup Energy for Next-Gen Fintech
    Thursday 22 October 2026
    HOYA BIT Explores AI Data Analysis Solutions for Smarter Trading
    Wednesday 21 October 2026
    Starting with Data Challenges: TS Holdings Explores AI Through Hackathon
    Tuesday 20 October 2026
    Cincoze's EMC Solution Boosts Equipment Stability and Production Efficiency