Mitsubishi Materials has announced the development of the world's largest rectangular silicon substrate, a technology gaining attention due to advancements in advanced packaging....

Glass Core Substrate (GCS) is becoming a trend that major players in the semiconductor supply chain are avidly pursuing. LG Innotek is reportedly contacting material, components,...

Glass substrate prices are expected to rise in the third quarter of 2024, reflecting the depreciation of the Japanese yen, the tight supply-demand balance, and profits made by some...

Driven by emerging applications such as electric vehicles (EV), AI, and high-performance computing (HPC), IC substrates have attracted significant attention in the semiconductor industry...

Gallium nitride (GaN), a third-generation compound semiconductor, has not developed as rapidly as silicon carbide (SiC). Nevertheless, this hasn't deterred new opportunists from joining...

Glass core substrates (GCS) are poised to play a crucial role in next-generation advanced chip packaging. In response, Japanese and South Korean semiconductor supply chain players...

Ibiden, the Japanese electronic component supplier, used to be seen as an Intel supply chain partner.

Samsung Electro-Mechanics (Semco) has commenced mass production at its ABF substrate plant in Vietnam, following a KRW 1 trillion (US$ 720 million) investment announced in 2021. This...

South Korea's leading IC design company, LX Semicon, is reportedly downsizing its Silicon Carbide (SiC) semiconductor R&D operations.

Taiwan's three leading IC substrate makers — Unimicron, Nan Ya PCB, and Kinsus — have posted mixed results for May.

Intel has announced the industry's first Glass Core Substrate (GCS) technology for next-generation advanced packaging, which has once again attracted market discussion due to the...

The market for ABF substrates is unlikely to see shortages return until the first quarter of 2026, according to T. J. Tseng, chairman of Unimicron Technology.

Abundant supply in China has domestic SiC substrate prices falling sharply since early 2024, according to industry sources.

Samsung Electro-Mechanics (Semco) is reportedly expediting the development of its semiconductor packaging-use Glass Core Substrate (GCS) business by advancing the construction of...

Despite slowing ABF substrate market growth, demand is expected to be fueled by rising demand for HPC and AI device applications.