TSMC introduced its open innovation platform (OIP) in 2008, when 40nm was the most advanced node on the market.

Packaging materials suppliers have seen customers slow down their pace of orders in the fourth quarter, and may encounter a decline in revenue compared to the previous quarter, according...

Denso and Mitsubishi Electric have agreed to invest an aggregate US$1 billion in Coherent's silicon carbide (SiC) business. The transaction results from the strategic review process...

Applied Materials and its equipment and materials partners have entered the supply chain for Intel's recently announced glass substrates for advanced packaging, according to industry...

At the TSMC 2023 OIP Ecosystem Forum, TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0...

Intel has announced that its first glass substrate for next-generation advanced packaging will enter mass production between 2026 and 2030.

According to Andrew Ho, general manager of Corning Display Technologies Taiwan, precision glass plays a crucial role in emerging display technologies. In his opinion, LCDs will continue...

ABF substrates may experience a reversal from a 5% oversupply in 2023 to a 5–8% shortage in 2024-2025, according to industry sources.

Wistron has secured significant GPU substrate orders for AI servers and anticipates its server product shipments will increase month by month for the remainder of this year, according...

Recent reports from the cross-strait supply chain indicate that a major Chinese new energy vehicle manufacturer had ambitious plans early this year to make significant inroads into...

With major CSPs aggressively building AI servers and pushing up demand for AI processors and HBM memory, global advanced packaging capacity is predicted to expand by 30–40%...

A fire broke out recently at one of Unimicron Technology's factories in Taoyuan, northern Taiwan. The IC substrate and PCB maker expects the incident to have a limited impact on its...

Tape chip-on-film (COF) substrate suppliers including Chipbond Technology and JMC Electronics have seen a modest increase in demand and are expected to see their operations improve...

Contract electronics vendor Foxconn has a sizable share in the upstream AI GPU module and substrate markets of the AI server supply chain, according to company chairman Young Liu.

Glass substrates may see tight supply starting from the third quarter of 2023 till the second half of next year, with major Japanese vendors axing their production despite signs of...