Taiwan IC backend industry to see more consolidation in 2010, says TICP chairman

Ingrid Lee, Taipei; Jessie Shen, DIGITIMES Asia Thursday 17 December 2009 0

The Taiwan IC packaging and testing industry will continue to consolidate in 2010, in the wake of Chipbond Technology's recently-announced merger with counterpart International Semiconductor Technology (IST), according to His-Che Teng, chairman of Taiwan...

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