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Chipbond, IST merger may complete ahead of schedule

Ingrid Lee, Taipei; Jessie Shen, DIGITIMES Asia Wednesday 20 January 2010 0

LCD driver IC packaging house Chipbond Technology has said its merger with International Semiconductor Technology (IST) may be finalized on April 1, 2010 at the earliest. The merger was originally scheduled to complete on June 1.

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