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SPIL stepping up pace of copper wirebonder purchases

Ingrid Lee, Taipei; Jessie Shen, DIGITIMES Asia Monday 1 February 2010 0

Siliconware Precision Industries (SPIL), which falls behind Advanced Semiconductor Engineering (ASE) in copper-wire bonding processes, plans to add an additional 400-600 copper wire bonders for a total of 600-800 units by the middle of 2010, according...

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