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Greatek and TICP to step into copper-wire bonding in 2Q10

Ingrid Lee, Taipei; Jessie Shen, DIGITIMES Asia Thursday 11 February 2010 0

With Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) aggressively ramping production on copper-wire bond processes, second-tier Taiwan-based IC packaging companies Greatek Electronics and Taiwan IC Packaging (TICP)...

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