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Chipbond seeing high utilization rates

Ingrid Lee, Taipei; Jessie Shen, DIGITIMES Asia Friday 26 February 2010 0

LCD driver IC backend house Chipbond Technology has stated that its utilization rates for the ongoing first quarter has returned to the high levels recorded in the third quarter of 2009, with bumping capacity currently running at 65% and COF (chip-on-film)...

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