UMC expects to sample 3D stacked chips using 28nm in 2011, says CEO

Ingrid Lee, Hsinchu; Jessie Shen, DIGITIMES Asia Tuesday 22 June 2010 0

United Microelectronics Corporation (UMC) expects to start sampling integrated 3D IC solutions using 28nm process technology in mid-2011, with volume production slated for 2012, according to company CEO Shih-Wei Sun. The foundry on June 21 announced...

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