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Taiwan-based LCD driver IC designers to adopt 12-inch processes soon

Ingrid Lee, Taipei; Willie Teng, DIGITIMES Asia Friday 12 November 2010 0

LCD driver IC design houses will transition into 12-inch processes at the end of 2010 to the first quarter of 2011. Chipbond Technology is currently the only backend chip packager with gold bumping capability for 12-inch wafers, which has allowed it...

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